BR25H040FJ-5ACE2
ActiveRohm Semiconductor
4KBIT, SPI BUS, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)
BR25H040FJ-5ACE2
ActiveRohm Semiconductor
4KBIT, SPI BUS, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)
Description
General part information
BR25H040FJ-5AC Series
BR25H040xxx-5AC Series is a 4Kbit serial EEPROM of SPI BUS Interface.
Technical Specifications
Parameters and characteristics for this part
| Specification | BR25H040FJ-5ACE2 |
|---|---|
| Clock Frequency | 20 MHz |
| Grade | Automotive |
| Memory Depth | 512 |
| Memory Format | EEPROM |
| Memory Interface (Type) | SPI |
| Memory Size | 4 Kbit |
| Memory Type | Non-Volatile |
| Memory Width | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.154 in |
| Package Name | 8-SOIC, 8-SOP-J |
| Package Width | 3.9 mm |
| Qualification | AEC-Q100 |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.7 V |
| Write Cycle Time - Page | 3.5 ms |
| Write Cycle Time - Word | 3.5 ms |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Design Guide and Example of Stencil for Exposed Pad
BR25H040FJ-5AC Data Sheet
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Opcode, Address, and Page Configuration for SPI BUS EEPROM
Five Steps for Successful Thermal Design of IC
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Thermal Resistance
Factory Information
Impedance Characteristics of Bypass Capacitor
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Solder Joint Rate and Thermal Resistance of Exposed Pad
Basics of Thermal Resistance and Heat Dissipation
What Is Thermal Design
SOP-J8 Package Information