Specification	S9KEAZN32BMLCR

Connectivity	I2C, LINbus, UART, SPI, USART
Core Processor	ARM® Cortex®-M0+
Core Size (Bit Width)	32 Bit
EEPROM Size (Depth)	256
EEPROM Size (Width)	8 bit
Grade	Automotive
Mounting Type	Surface Mount
Number of I/O	28
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal, External
Package / Case	32-LQFP
Package Length	7 mm
Package Name	32-LQFP
Package Width	7 mm
Peripherals	WDT, PWM, POR, LVD
Program Memory Depth	32 K
Program Memory Size	32 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
Qualification	AEC-Q100
RAM Size Depth	4 K
RAM Size Width	8 bit
Speed	40 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

S9 Series

Part	Qualification	Program Memory Size	Program Memory Width	Program Memory Depth	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Package Length	Package Name	Package Width	RAM Size Depth	RAM Size Width	Connectivity	Oscillator Type	Core Processor	Operating Temperature (Max)	Operating Temperature (Min)	Grade	Number of I/O	Peripherals	EEPROM Size (Width)	EEPROM Size (Depth)	Mounting Type	Speed	Core Size (Bit Width)	Package / Case	Program Memory Type
NXP USA Inc. S9KEAZN32BMLCR	AEC-Q100	32 KB	8 bit	32 K	2.7 V	5.5 V	7 mm	32-LQFP	7 mm	4 K	8 bit	I2C LINbus SPI UART USART	External Internal	ARM® Cortex®-M0+	125 °C	-40 °C	Automotive	28	LVD POR PWM WDT	8 bit	256	Surface Mount	40 MHz	32 Bit	32-LQFP	FLASH
NXP USA Inc. S9KEAZN64BMLC
NXP USA Inc. S9KEAZN32BVLCR

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