114-87-632-41-134191

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Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

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114-87-632-41-134191

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Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

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Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1200	$ 1.74

Description

General part information

114-87 Series

32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount

Documents

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	114-87-632-41-134191	114-87 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	Flash	Flash
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Surface Mount	Surface Mount
Number of Positions or Pins (Grid)	-	2 - 48
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	6
Number of Positions or Pins (Grid)	-	3
Number of Positions or Pins (Grid)	-	10
Number of Positions or Pins (Grid) [custom]	2 x 16	2 x 16, 2 x 5
Number of Positions or Pins (Grid) [custom]	32	32
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	1.2 mm	1.2 mm
Termination Post Length [x]	0.047 in	0.047 in
Type	DIP	DIP
Type	0.6 in	0.3 - 0.6 "
Type	15.24 mm	7.62 - 15.24 mm

114-87 Series

16P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+125℃ 2.54MM IC / TRANSISTOR SOCKET ROHS

Part	Material Flammability Rating	Current Rating (Amps)	Contact Material - Mating	Contact Material - Post [custom]	Contact Finish - Mating	Features	Contact Resistance	Termination Post Length	Termination Post Length [x]	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Housing Material	Type	Type	Type	Contact Finish Thickness - Mating	Termination	Contact Finish - Post	Mounting Type	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 114-87-316-41-117101	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in	16	0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.3 "	7.62 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C
Preci-Dip 114-87-648-41-117101	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in	48	0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.6 in	15.24 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C
Preci-Dip 114-87-312-41-117101	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in	2, 6, 12	0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.3 "	7.62 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C
Preci-Dip 114-87-318-41-134161	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in	18	0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.3 "	7.62 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C
Preci-Dip 114-87-306-41-134191	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in		0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.3 "	7.62 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C	2	6	3
Preci-Dip 114-87-632-41-134191	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in		0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.6 in	15.24 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C				2 x 16	32
Preci-Dip 114-87-306-41-134161	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in		0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.3 "	7.62 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C	2	6	3
Preci-Dip 114-87-628-41-117101	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in	28	0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.6 in	15.24 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C
Preci-Dip 114-87-632-41-134161	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in		0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.6 in	15.24 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C				2 x 16	32
Preci-Dip 114-87-314-41-134161	UL94 V-0	1 A	Beryllium Copper	Brass	Gold	Open Frame	10 mOhm	1.2 mm	0.047 in	14	0.1 in	2.54 mm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.3 "	7.62 mm	DIP	Flash	Solder	Tin	Surface Mount	2.54 mm	0.1 in	-55 °C	125 °C