Specification	ESQT-108-02-M-D-310

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	20 Ąin
Contact Length - Post	0.54 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Per Contact)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.31 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	16
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.079 in
Row Spacing - Mating	0.079 in
Style	Board, Board or Cable
Termination	Solder

ESQT Series

...

Part	Style	Termination	Mounting Type	Insulation Height	Contact Finish - Mating	Contact Type	Number of Positions Loaded	Material Flammability Rating	Current Rating (Per Contact)	Number of Positions	Contact Finish - Post	Contact Finish Thickness - Mating	Number of Rows	Operating Temperature (Max)	Operating Temperature (Min)	Connector Type	Row Spacing - Mating	Pitch - Mating	Fastening Type	Contact Length - Post	Insulation Color	Contact Shape	Insulation Material	Contact Material	Contact Finish Thickness - Post
Samtec Inc. ESQT-105-03-G-D-368	Board Board or Cable	Solder	Through Hole	0.368 in	Gold	Forked	All	UL94 V-0	4.5 A	10	Gold	20 Ąin	2	125 °C	-55 °C	Elevated Socket	0.079 in	0.079 in	Push-Pull	0.09 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	3 µin
Samtec Inc. ESQT-105-03-L-D-325	Board Board or Cable	Solder	Through Hole	0.325 in	Gold	Forked	All	UL94 V-0	4.5 A	10	Tin	10 µin	2	125 °C	-55 °C	Elevated Socket	0.079 in	0.079 in	Push-Pull	0.133 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze
Samtec Inc. ESQT-105-02-F-S-550	Board Board or Cable	Solder	Through Hole	0.55 in	Gold	Forked	All	UL94 V-0	4.5 A	5	Tin	3 µin	1	125 °C	-55 °C	Elevated Socket		0.079 in	Push-Pull	0.3 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze
Samtec Inc. ESQT-105-02-M-D-535	Board Board or Cable	Solder	Through Hole	0.535 in	Gold	Forked	All	UL94 V-0	4.5 A	10	Tin	20 Ąin	2	125 °C	-55 °C	Elevated Socket	0.079 in	0.079 in	Push-Pull	0.315 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze
Samtec Inc. ESQT-105-02-L-D-572	Board Board or Cable	Solder	Through Hole	0.572 in	Gold	Forked	All	UL94 V-0	4.5 A	10	Tin	10 µin	2	125 °C	-55 °C	Elevated Socket	0.079 in	0.079 in	Push-Pull	0.278 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze
Samtec Inc. ESQT-105-02-G-D-415	Board Board or Cable	Solder	Through Hole	0.415 in	Gold	Forked	All	UL94 V-0	4.5 A	10	Gold	20 Ąin	2	125 °C	-55 °C	Elevated Socket	0.079 in	0.079 in	Push-Pull	0.435 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	3 µin
Samtec Inc. ESQT-105-02-G-D-614	Board Board or Cable	Solder	Through Hole	0.614 in	Gold	Forked	All	UL94 V-0	4.5 A	10	Gold	20 Ąin	2	125 °C	-55 °C	Elevated Socket	0.079 in	0.079 in	Push-Pull	0.236 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	3 µin
Samtec Inc. ESQT-105-03-F-D-370	Board Board or Cable	Solder	Through Hole	0.37 in	Gold	Forked	All	UL94 V-0	4.5 A	10	Tin	3 µin	2	125 °C	-55 °C	Elevated Socket	0.079 in	0.079 in	Push-Pull	0.088 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze
Samtec Inc. ESQT-105-02-F-S-520	Board Board or Cable	Solder	Through Hole	0.52 in	Gold	Forked	All	UL94 V-0	4.5 A	5	Tin	3 µin	1	125 °C	-55 °C	Elevated Socket		0.079 in	Push-Pull	0.33 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze
Samtec Inc. ESQT-105-02-L-D-354	Board Board or Cable	Solder	Through Hole	0.354 in	Gold	Forked	All	UL94 V-0	4.5 A	10	Tin	10 µin	2	125 °C	-55 °C	Elevated Socket	0.079 in	0.079 in	Push-Pull	0.496 in	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze

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