Specification	S2M-110-01-F-D

Connector Type	Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	3 µin
Contact Length - Post	0.082 in
Contact Material	Beryllium Copper
Contact Shape	Square
Contact Type	Female Socket
Current Rating (Per Contact)	2.6 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.178 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	20
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.079 in
Row Spacing - Mating	0.079 in
Style	Board, Board or Cable
Termination	Solder

S2M-110 Series

Part	Row Spacing - Mating	Insulation Color	Style	Contact Finish Thickness - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Current Rating (Per Contact)	Insulation Height	Number of Positions Loaded	Termination	Fastening Type	Contact Finish - Post	Pitch - Mating	Contact Type	Number of Rows	Mounting Type	Contact Finish - Mating	Connector Type	Number of Positions	Contact Material	Contact Shape	Insulation Material	Contact Length - Post
Samtec Inc. S2M-110-02-L-D	0.079 in	Black	Board Board or Cable	10 µin	125 °C	-55 °C	2.6 A	0.178 in	All	Solder	Push-Pull	Tin	0.079 in	Female Socket	2	Surface Mount	Gold	Socket	20	Beryllium Copper	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. S2M-110-01-F-D	0.079 in	Black	Board Board or Cable	3 µin	125 °C	-55 °C	2.6 A	0.178 in	All	Solder	Push-Pull	Tin	0.079 in	Female Socket	2	Through Hole	Gold	Socket	20	Beryllium Copper	Square	Liquid Crystal Polymer (LCP)	0.082 in
Samtec Inc. S2M-110-01-L-D	0.079 in	Black	Board Board or Cable	10 µin	125 °C	-55 °C	2.6 A	0.178 in	All	Solder	Push-Pull	Tin	0.079 in	Female Socket	2	Through Hole	Gold	Socket	20	Beryllium Copper	Square	Liquid Crystal Polymer (LCP)	0.082 in

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