Specification	BYV25FX-600,127

Current - Average Rectified (Io)	5 A
Current - Reverse Leakage	50 µA
Mounting Type	Through Hole
Operating Temperature - Junction (Max)	150 °C
Package / Case	TO-220-2 Full Pack, Isolated Tab
Package Name	TO-220F, TO-220FP
Reverse Recovery Time (trr)	35 ns
Speed - Fast Recovery (Maximum)	500 ns
Speed - Fast Recovery (Minimum)	200 mA
Technology	Standard
Voltage - DC Reverse (Vr) (Max)	600 V
Voltage - Forward (Vf) (Max)	1.9 V

BYV25 Series

Part	Mounting Type	Package Name	Speed - Fast Recovery (Maximum)	Speed - Fast Recovery (Minimum)	Voltage - DC Reverse (Vr) (Max)	Operating Temperature - Junction (Max)	Package / Case	Current - Reverse Leakage	Reverse Recovery Time (trr)	Current - Average Rectified (Io)	Technology	Voltage - Forward (Vf) (Max)
WeEn Semiconductors BYV25G-600,127	Through Hole	I2PAK (TO-262) TO-262 (I2PAK)	500 ns	200 mA	600 V	150 °C	I2PAK TO-262-3 Long Leads TO-262AA	50 µA	60 ns	5 A	Standard	1.3 V
WeEn Semiconductors BYV25FD-600,118	Surface Mount	DPak	500 ns	200 mA	600 V	150 °C	DPAK (2 Leads + Tab) SC-63 TO-252-3	50 µA	35 ns	5 A	Standard	1.9 V
WeEn Semiconductors BYV25D-600,118	Surface Mount	DPak	500 ns	200 mA	600 V	150 °C	DPAK (2 Leads + Tab) SC-63 TO-252-3	50 µA	60 ns	5 A	Standard	1.3 V
WeEn Semiconductors BYV25FB-600,118	Surface Mount	D2PAK	500 ns	200 mA	600 V	150 °C	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB	50 µA	35 ns	5 A	Standard	1.9 V
WeEn Semiconductors BYV25X-600,127	Through Hole	TO-220FP	500 ns	200 mA	600 V	150 °C	Isolated Tab TO-220-2 Full Pack	50 µA	60 ns	5 A	Standard	1.3 V
WeEn Semiconductors BYV25FX-600,127	Through Hole	TO-220F TO-220FP	500 ns	200 mA	600 V	150 °C	Isolated Tab TO-220-2 Full Pack	50 µA	35 ns	5 A	Standard	1.9 V
WeEn Semiconductors BYV25F-600,127	Through Hole	TO-220AC	500 ns	200 mA	600 V	150 °C	TO-220-2	50 µA	35 ns	5 A	Standard	1.9 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources

No documents available