Specification	FXPS7550DS4T1

Accuracy	0.51 PSI
Maximum Pressure	12.62 PSI
Mounting Type	Wettable Flank, Surface Mount
Operating Pressure (Max)	79.77 PSI
Operating Pressure (Min)	2.9 PSI
Operating Temperature (Max)	130 °C
Operating Temperature (Min)	-40 °C
Output Bits	32 b
Output Type	SPI
Package / Case	16-QFN Exposed Pad
Package Length	4 mm
Package Name	16-HQFN
Package Width	4 mm
Port Style	No Port
Pressure Type	Absolute
Termination Style	SMD (SMT) Tab
Voltage - Supply (Maximum)	5.25 V
Voltage - Supply (Minimum)	3.1 V

FXPS75 Series

Part	Operating Temperature (Max)	Operating Temperature (Min)	Output Type	Maximum Pressure	Pressure Type	Accuracy	Port Style	Termination Style	Applications	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Output Voltage (Min)	Output Voltage (Max)	Mounting Type	Operating Pressure (Max)	Operating Pressure (Min)	Package Length	Package Width	Package Name	Package / Case	Output Bits
NXP USA Inc. FXPS7550A4T1	130 °C	-40 °C	Analog Voltage	87.02 PSI	Absolute	3 % RH	No Port	SMD (SMT) Tab	Board Mount	3.1 V	5.25 V	0 V	4.6 V	Surface Mount Wettable Flank	79.77 PSI	2.9 PSI	4 mm	4 mm	16-HQFN	16-QFN Exposed Pad
NXP USA Inc. FXPS7550DS4T1	130 °C	-40 °C	SPI	12.62 PSI	Absolute	0.51 PSI	No Port	SMD (SMT) Tab		3.1 V	5.25 V			Surface Mount Wettable Flank	79.77 PSI	2.9 PSI	4 mm	4 mm	16-HQFN	16-QFN Exposed Pad	32 b
NXP USA Inc. FXPS7550DI4T1	130 °C	-40 °C	I2C	12.62 PSI	Absolute	0.51 PSI	No Port	SMD (SMT) Tab		3.1 V	5.25 V			Surface Mount Wettable Flank	79.77 PSI	2.9 PSI	4 mm	4 mm	16-HQFN	16-QFN Exposed Pad	32 b

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