Specification	W66BL6NBUAFJ TR

Access Time	3.5 ns
Clock Frequency	1.6 GHz
Memory Depth	128 M
Memory Format	DRAM
Memory Interface (Type)	LVSTL_11
Memory Size	2 Gbit
Memory Type	Volatile
Memory Width	16 bit
Mounting Type	Surface Mount
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Package / Case	200-WFBGA
Package Length	10 mm
Package Name	200-WFBGA
Package Width	14.5 mm
Technology	SDRAM - Mobile LPDDR4
Voltage - Supply (Range 1 Maximum)	1.17 V
Voltage - Supply (Range 1 Minimum)	1.06 V
Voltage - Supply (Range 2 Maximum)	1.95 V
Voltage - Supply (Range 2 Minimum)	1.7 V
Write Cycle Time - Page	18 ns
Write Cycle Time - Word	18 ns

W66BL6 Series

Part	Memory Depth	Memory Width	Memory Type	Access Time	Memory Format	Write Cycle Time - Word	Write Cycle Time - Page	Clock Frequency	Package Width	Package Name	Package Length	Operating Temperature (Min)	Operating Temperature (Max)	Voltage - Supply (Range 2 Maximum)	Voltage - Supply (Range 1 Maximum)	Voltage - Supply (Range 2 Minimum)	Voltage - Supply (Range 1 Minimum)	Mounting Type	Technology	Memory Size	Package / Case	Memory Interface (Type)
Winbond Electronics W66BL6NBUAHJ TR	128 M	16 bit	Volatile	3.5 ns	DRAM	18 ns	18 ns	2.133 GHz	14.5 mm	200-WFBGA	10 mm	-40 °C	105 °C	1.95 V	1.17 V	1.7 V	1.06 V	Surface Mount	SDRAM - Mobile LPDDR4	2 Gbit	200-WFBGA	LVSTL_11
Winbond Electronics W66BL6NBUAFJ TR	128 M	16 bit	Volatile	3.5 ns	DRAM	18 ns	18 ns	1.6 GHz	14.5 mm	200-WFBGA	10 mm	-40 °C	105 °C	1.95 V	1.17 V	1.7 V	1.06 V	Surface Mount	SDRAM - Mobile LPDDR4	2 Gbit	200-WFBGA	LVSTL_11
Winbond Electronics W66BL6NBUAHJ	128 M	16 bit	Volatile	3.5 ns	DRAM	18 ns	18 ns	2.133 GHz	14.5 mm	200-WFBGA	10 mm	-40 °C	105 °C	1.95 V	1.17 V	1.7 V	1.06 V	Surface Mount	SDRAM - Mobile LPDDR4	2 Gbit	200-WFBGA	LVSTL_11
Winbond Electronics W66BL6NBUAGJ TR	128 M	16 bit	Volatile	3.5 ns	DRAM	18 ns	18 ns	1866 MHz	14.5 mm	200-WFBGA	10 mm	-40 °C	105 °C	1.95 V	1.17 V	1.7 V	1.06 V	Surface Mount	SDRAM - Mobile LPDDR4	2 Gbit	200-WFBGA	LVSTL_11

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