Specification	TDA2HVBDQABCRQ1

Architecture	MPU, DSP
Connectivity	SDIO, SD, USB, I2C, MMC, McASP, SPI, CANbus, UART, Ethernet
Core Processor	Dual ARM® Cortex®-M4, ARM® Cortex®-A15, C66x
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package / Case	FCBGA, 760-BFBGA
Package Length	23 mm
Package Name	760-FCBGA
Package Width	23 mm
Peripherals	DMA, POR, WDT, PWM
RAM Size	2.5 MB
Speed	500 MHz

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