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EFR32BG12P433F1024GL125-C

EFR32BG12P433F1024GL125-C

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SILICON LABS

RF SYSTEM ON A CHIP - SOC BLUE GECKO BLE SOC BGA125 DUAL 19 DB BLE/PROPRIETARY 1024 KB 256 KB (RAM) 65GPIO

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EFR32BG12P433F1024GL125-C

EFR32BG12P433F1024GL125-C

Active
SILICON LABS

RF SYSTEM ON A CHIP - SOC BLUE GECKO BLE SOC BGA125 DUAL 19 DB BLE/PROPRIETARY 1024 KB 256 KB (RAM) 65GPIO

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Description

General part information

EFR32BG12 Series

RF SYSTEM ON A CHIP - SOC BLUE GECKO BLE SOC BGA125 DUAL 19 DB BLE/PROPRIETARY 1024 KB 256 KB (RAM) 65GPIO

Technical Specifications

Parameters and characteristics for this part

SpecificationEFR32BG12P433F1024GL125-C
Current - Receiving (Max)10 mA
Current - Receiving (Min)8.4 mA
Current - Transmitting (Max)35.3 mA
Current - Transmitting (Min)8.5 mA
Data Rate (Max)2 MBaud
Frequency2.4 GHz
GPIO Count65
Memory Size256 kB
Memory Size (Flash)1 MB
Memory TypeFlash, RAM
ModulationGMSK, 4FSK, BPSK, DSSS, 2GFSK, 4GFSK, GFSK, MSK, ASK, OOK, DBPSK, 2FSK, OQPSK
Mounting TypeSurface Mount
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Package / Case125-VFBGA
Package Length7 mm
Package Name125-BGA
Package Width7 mm
Power - Output19 dBm
ProtocolBluetooth v5.0
RF Family/Standard802.15.4, Bluetooth
Sensitivity-95 dBm
Serial InterfacesSPI, I2C, I2S, UART
TypeTxRx + MCU
Voltage - Supply (Maximum)3.8 V
Voltage - Supply (Minimum)1.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources