
PSMN2R4-30YLDX
ActiveNexperia USA Inc.
N-CHANNEL 30 V, 2.4 MΩ LOGIC LEVEL MOSFET IN LFPAK56 USING NEXTPOWERS3 TECHNOLOGY

PSMN2R4-30YLDX
ActiveNexperia USA Inc.
N-CHANNEL 30 V, 2.4 MΩ LOGIC LEVEL MOSFET IN LFPAK56 USING NEXTPOWERS3 TECHNOLOGY
Description
General part information
PSMN2R4-30YLD Series
Ultra low QG, QGDand QOSSfor high system efficiency, especially at higher switching frequencies
Superfast switching with soft-recovery; s-factor > 1
Low spiking and ringing for low EMI designs
Technical Specifications
Parameters and characteristics for this part
| Specification | PSMN2R4-30YLDX |
|---|---|
| Current - Continuous Drain (Id) (Tc) | 100 A |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On) | 4.5 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 31.3 nC |
| Input Capacitance (Ciss) (Max) | 2256 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | SOT-669, SC-100 |
| Package Name | LFPAK56, Power-SO8 |
| Power Dissipation (Max) | 106 W |
| Rds On (Max) | 2.4 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.2 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Using power MOSFETs in parallel
Reflow soldering profile
Nexperia package poster
plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body
Power MOSFET frequently asked questions and answers
RC Thermal Models
plastic, single-ended surface-mounted package; 4 terminals
Questions about package outline drawings
Foster model PSMN2R4-30YLD
PSMN2R4-30YLD Quality document
LFPAK MOSFET thermal design guide - Part 2
Wave soldering profile
LFPAK MOSFET thermal design guide, Chinese version
Cauer model PSMN2R4-30YLD
LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation