74LVC06APW,118

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Nexperia USA Inc.

HEX INVERTER WITH OPEN-DRAIN OUTPUTS

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74LVC06APW,118

Active

Nexperia USA Inc.

HEX INVERTER WITH OPEN-DRAIN OUTPUTS

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Description Specifications Series Pricing CAD Documents

Description

General part information

74LVC06APW Series

The 74LVC06A provides six inverting buffers. The outputs are open-drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.

Technical Specifications

Parameters and characteristics for this part

Specification	74LVC06APW,118

Current - Output Low	32 mA
Current - Quiescent (Max)	40 ĄA
Features	Open Drain
Input Logic Level - High (Max)	2 V
Input Logic Level - High (Min)	1.08 V
Input Logic Level - Low (Max)	0.8 V
Input Logic Level - Low (Min)	0.12 V
Logic Type	Inverter
Max CL	50 pF
Max Propagation Delay	2.5 ns
Mounting Type	Surface Mount
Number of Circuits	6
Number of Inputs	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package Length	0.173 in
Package Name	14-TSSOP
Package Width	4.4 mm
Voltage - Supply (Maximum)	5.5 V
Voltage - Supply (Minimum)	1.2 V

74LVC06APW Series

Hex inverter with open-drain outputs

Part	Number of Circuits	Mounting Type	Input Logic Level - Low (Max)	Input Logic Level - Low (Min)	Max Propagation Delay	Max CL	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Features	Current - Quiescent (Max)	Number of Inputs	Logic Type	Package Name	Current - Output Low	Input Logic Level - High (Max)	Input Logic Level - High (Min)	Package Width	Package Length	Operating Temperature (Max)	Operating Temperature (Min)
Nexperia USA Inc. 74LVC06APW,118	6	Surface Mount	0.8 V	0.12 V	2.5 ns	50 pF	5.5 V	1.2 V	Open Drain	40 ĄA	1	Inverter	14-TSSOP	32 mA	2 V	1.08 V	4.4 mm	0.173 in	125 °C	-40 °C

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

TSSOP14; Reel pack for SMD, 13"; Q1/T1 product orientation

Footprint for wave soldering

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body

Pin FMEA for LVC family

Power considerations when using CMOS and BiCMOS logic devices

74LVC06APW Nexperia Product Reliability

Nexperia package poster

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body