Specification	WB75FC120ALZ

Current - Average Rectified (Io)	75 A
Current - Reverse Leakage	250 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	175 °C
Package / Case	Die
Package Name	Wafer
Reverse Recovery Time (trr)	85 ns
Speed - Fast Recovery (Maximum)	500 ns
Speed - Fast Recovery (Minimum)	200 mA
Technology	Standard
Voltage - DC Reverse (Vr) (Max)	1200 V
Voltage - Forward (Vf) (Max)	3.3 V, 3.3 V

WB75 Series

Part	Technology	Voltage - DC Reverse (Vr) (Max)	Speed - Fast Recovery (Maximum)	Speed - Fast Recovery (Minimum)	Operating Temperature - Junction	Voltage - Forward (Vf) (Max)	Mounting Type	Package / Case	Current - Average Rectified (Io)	Current - Reverse Leakage	Reverse Recovery Time (trr)	Package Name
WeEn Semiconductors WB75FC65ALZ	Standard	650 V	500 ns	200 mA	175 °C	2.75 V	Surface Mount	Die	75 A	10 µA	50 ns	Wafer
WeEn Semiconductors WB75FC120ALZ	Standard	1200 V	500 ns	200 mA	175 °C	3.3 V 3.3 V	Surface Mount	Die	75 A	250 µA	85 ns	Wafer

Pricing

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