Specification	224-1275-19-0602J

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	30 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Convert From (Adapter End)	DIP
Convert From (Adapter End) Row Spacing	0.6 "
Convert From (Adapter End) Type	DIP, Row Spacing
Convert To (Adapter End) Size	0.6 in
Convert To (Adapter End) Type	Row Spacing, DIP
Current Rating	1 A
Features	Closed Frame
Housing Material	Polysulfone, PSU, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Pins	24
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.62 in

224 Series

Part	Termination Post Length	Contact Resistance	Termination	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Type	Contact Finish - Post	Mounting Type	Pitch - Mating	Housing Material	Contact Material - Mating	Contact Finish - Mating	Contact Material - Post	Operating Temperature (Max)	Operating Temperature (Min)	Row Spacing	Pitch - Post	Contact Finish Thickness - Mating	Features	Contact Finish Thickness - Post	Current Rating	Material Flammability Rating	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Convert From (Adapter End)	Convert From (Adapter End) Type	Convert From (Adapter End) Row Spacing	Number of Pins
3M Electronic Specialty 224-5205-01	0.118 in	25 mOhm	Solder	24	4	4	QFN	Gold	Through Hole	0.02 in	PES Polyethersulfone	Beryllium Copper	Gold	Beryllium Copper
3M Electronic Specialty 224-5248-00-0602J	0.11 in	15 mOhm	Press-Fit	24	12	2	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Gold	Connector	0.1 in	Glass Filled Polysulfone PSU	Beryllium Copper	Gold	Beryllium Copper	125 °C	-55 °C	0.3 in	0.1 in	30 µin	Closed Frame	30 µin	1 A	UL94 V-0
3M Electronic Specialty 224-1275-19-0602J	0.62 in		Wire Wrap					Gold	Through Hole	0.1 in	Glass Filled Polysulfone PSU	Beryllium Copper	Gold	Beryllium Copper	125 °C	-55 °C		0.1 in	30 µin	Closed Frame	30 µin	1 A	UL94 V-0	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "	24
3M Electronic Specialty 224-5248-19-0602J			Solder					Gold	Through Hole	0.1 in	Glass Filled Polysulfone PSU	Beryllium Copper	Gold	Beryllium Copper	125 °C	-55 °C		0.1 in	30 µin		30 µin	1 A	UL94 V-0	0.3 in	DIP Row Spacing	DIP	DIP Row Spacing	0.3 "	24
3M Electronic Specialty 224-1275-29-0602J	0.13 in		Solder					Gold	Through Hole	0.1 in	Glass Filled Polysulfone PSU	Beryllium Copper	Gold	Beryllium Copper	125 °C	-55 °C		0.1 in	30 µin	Closed Frame	30 µin	1 A	UL94 V-0	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "	24

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