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AG091FLD3HRBTL

AG091FLD3HRBTL

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Rohm Semiconductor

NCH 60V 80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

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AG091FLD3HRBTL

AG091FLD3HRBTL

Active
Rohm Semiconductor

NCH 60V 80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

Find alt

Description

General part information

AG091FLD3HRB Series

AG091FLD3HRB is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for Automotive Systems.

Technical Specifications

Parameters and characteristics for this part

SpecificationAG091FLD3HRBTL
Current - Continuous Drain (Id) (Tc)80 A
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On)4.5 V
Drive Voltage (Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Max)22 nC
GradeAutomotive
Input Capacitance (Ciss) (Max)1480 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Package NameTO-252
Power Dissipation (Max)76 W
QualificationAEC-Q101
Rds On (Max)7.5 mOhm
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max)2.5 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation
Report of SVHC under REACH Regulation
Compliance of the RoHS directive
Anti-Whisker formation - Transistors
How to Use LTspice® Models: Tips for Improving Convergence
AG091FLD3HRB ESD Data
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Precautions When Measuring the Rear of the Package with a Thermocouple
Explanation for Marking
Types and Features of Transistors
θ<sub>JA</sub> and Ψ<sub>JT</sub>
MOSFET Gate Resistor Setting for Motor Driving
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Condition of Soldering / Land Pattern Reference
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Temperature derating method for Safe Operating Area (SOA)
Importance of Probe Calibration When Measuring Power: Deskew
Part Explanation
Two-Resistor Model for Thermal Simulation
What is a Thermal Model? (Transistor)
Notes for Calculating Power Consumption:Static Operation
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Calculation of Power Dissipation in Switching Circuit
Method for Monitoring Switching Waveform
Notes for Temperature Measurement Using Thermocouples
MOSFET Gate Drive Current Setting for Motor Driving
What Is Thermal Design
Report of SVHC under REACH Regulation
Package Dimensions
Moisture Sensitivity Level - Transistors
How to Use LTspice&reg; Models
AG091FLD3HRB Data Sheet
PCB Layout Thermal Design Guide
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
About Flammability of Materials
List of Transistor Package Thermal Resistance
TO-252_TL Taping Information
About Export Regulations
Judgment Criteria of Thermal Evaluation
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Impedance Characteristics of Bypass Capacitor
Measurement Method and Usage of Thermal Resistance RthJC