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STMICROELECTRONICS STW13NK60Z

RGW60TS65EHRC11

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Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 30A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

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STMICROELECTRONICS STW13NK60Z

RGW60TS65EHRC11

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 30A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

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Description

General part information

RGW60 Series

The RGWxx65C series is a 650V IGBT with a built-in SiC schottky barrier diode, which reduces turn-on switching loss. This is an AEC-Q101 compliant product. It can be used with confidence even in harsh environments such as xEV on-board chargers, DC/DC converters, solar power conditioners, and UPS.

Technical Specifications

Parameters and characteristics for this part

SpecificationRGW60TS65EHRC11
Current - Collector (Ic) (Max)64 A
Current - Collector Pulsed (Icm)120 A
Gate Charge84 nC
IGBT TypeTrench Field Stop
Input TypeStandard
Mounting TypeThrough Hole
Operating Temperature (Max)175 °C
Operating Temperature (Min)-40 °C
Package / CaseTO-247-3
Package NameTO-247N
Power - Max178 W
Reverse Recovery Time (trr)146 ns
Td (off) @ 25°C101 ns
Td (on) @ 25°C37 ns
Test Condition Current15 A
Test Condition Resistance10 Ohm
Test Condition Voltage400 V
Test Condition Voltage (Secondary)15 V
Vce(on) (Max)1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
Datasheet
θ<sub>JC</sub> and Ψ<sub>JT</sub>
About Export Administration Regulations (EAR)
Measurement Method and Usage of Thermal Resistance RthJC
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
Notes for Temperature Measurement Using Thermocouples
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Calculation of Power Dissipation in Switching Circuit
θ<sub>JA</sub> and Ψ<sub>JT</sub>
How to Use LTspice&reg; Models: Tips for Improving Convergence
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
How to Create Symbols for PSpice Models
Importance of Probe Calibration When Measuring Power: Deskew
Two-Resistor Model for Thermal Simulation
Types and Features of Transistors
Precautions for Thermal Resistance of Insulation Sheet
Anti-Whisker formation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
How to Use LTspice&reg; Models
The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
Judgment Criteria of Thermal Evaluation
Compliance of the ELV directive
Estimation of switching losses in IGBTs operating with resistive load
How to Use the Thermal Resistance and Thermal Characteristics Parameters
What Is Thermal Design
Moisture Sensitivity Level
Basics of Thermal Resistance and Heat Dissipation
Package Dimensions
Impedance Characteristics of Bypass Capacitor
Notes for Calculating Power Consumption:Static Operation
Part Explanation
Precautions When Measuring the Rear of the Package with a Thermocouple
PCB Layout Thermal Design Guide
About Flammability of Materials
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules
What is a Thermal Model? (IGBT)
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Method for Monitoring Switching Waveform
4 Steps for Successful Thermal Designing of Power Devices