UPD70F3526GJA-GBG-Q-G

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Renesas Electronics Corporation

IC MCU 32BIT FLASH SMD

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Renesas Electronics Corporation

IC MCU 32BIT FLASH SMD

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General part information

* Microcontroller IC

Technical documentation and resources

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Parameters and characteristics commom to parts in this series

Specification	UPD70F3526GJA-GBG-Q-G	UPD70F3526 Series

Connectivity	-	EBI/EMI, USB, LINbus, SPI, SCI, CANbus, SSI, Ethernet, I2C, UART/USART
Core Processor	-	V850E2M
Core Size	-	32-Bit
Data Converters	-	10 - 16 b
Data Converters	-	A/D
EEPROM Size	-	32 K
Mounting Type	-	Surface Mount
null		-
Number of I/O	-	105
Operating Temperature	-	105 °C
Operating Temperature	-	-40 °C
Oscillator Type	-	Internal
Package / Case	-	144-LQFP
Peripherals	-	DMA, WDT, POR, LVD, PWM, LCD, I2S
Program Memory Size	-	3 MB
Program Memory Type	-	FLASH
RAM Size	-	256 K
Speed	-	120 MHz
Supplier Device Package	-	144-LQFP (20x20)
Voltage - Supply (Vcc/Vdd)	-	2.7 V
Voltage - Supply (Vcc/Vdd)	-	5.5 V

IC MCU 32BIT FLASH SMD

Part	Speed	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Operating Temperature [Max]	Operating Temperature [Min]	Number of I/O	Core Processor	Core Size	Supplier Device Package	Program Memory Type	RAM Size	Data Converters	Data Converters	Peripherals	Package / Case	Connectivity	Program Memory Size	Oscillator Type	Mounting Type	EEPROM Size
Renesas Electronics Corporation UPD70F3526GJA-GBG-Q-G
Renesas Electronics Corporation UPD70F3526GJA9-GAE-Q-H	120 MHz	2.7 V	5.5 V	105 °C	-40 °C	105	V850E2M	32-Bit	144-LQFP (20x20)	FLASH	256 K	10 b, 12 b, 16	A/D	DMA, I2S, LCD, LVD, POR, PWM, WDT	144-LQFP	CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB	3 MB	Internal	Surface Mount	32 K
Renesas Electronics Corporation UPD70F3526GJA9-GAE-X3-G	120 MHz	2.7 V	5.5 V	105 °C	-40 °C	105	V850E2M	32-Bit	144-LQFP (20x20)	FLASH	256 K	10 b, 12 b, 16	A/D	DMA, I2S, LCD, LVD, POR, PWM, WDT	144-LQFP	CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB	3 MB	Internal	Surface Mount	32 K