
ATS-X53330G-C1-R0
ActiveAdvanced Thermal Solutions Inc.
HEAT SINKS BGA COOLING SOLUTIONS WITH SUPERGRIP ATTACHMENT, HIGH PERFORMANCE, 33X33X12.5MM
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ATS-X53330G-C1-R0
ActiveAdvanced Thermal Solutions Inc.
HEAT SINKS BGA COOLING SOLUTIONS WITH SUPERGRIP ATTACHMENT, HIGH PERFORMANCE, 33X33X12.5MM
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | ATS-X53330G-C1-R0 | 
|---|---|
| Attachment Method | Clip, Thermal Material | 
| Fin Height | 12.5 mm | 
| Fin Height | 0.492 in | 
| Length | 32.99 mm | 
| Length | 1.299 in | 
| Material | Aluminum | 
| Material Finish | Blue Anodized | 
| Package Cooled | BGA | 
| Shape | Square, Fins | 
| Thermal Resistance @ Forced Air Flow | 5.8 °C/W | 
| Type | Top Mount | 
| Width [x] | 32.99 mm | 
| Width [x] | 1.299 in | 
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
BGA Low Profile Series
Heat Sinks maxiFLOW BGA Heat Sink w/maxiGRIP Attachment, T412, 45x45x14.5mm, 69.6mm Fin Tip
Documents
Technical documentation and resources