
BD65491FV-E2
ActiveRohm Semiconductor
1-CHANNEL LENS DRIVER FOR SINGLE-LENS REFLEX CAMERAS

BD65491FV-E2
ActiveRohm Semiconductor
1-CHANNEL LENS DRIVER FOR SINGLE-LENS REFLEX CAMERAS
Description
General part information
BD65491 Series
The BD65491FV motor driver provides 1 Full-ON Drive H-bridge channel, while BD65492MUV provides 2 Full-ON Drive H-bridge channels. These ICs feature wide range operating from 1.8V and low power consumption by high switching speed in a compact surface mount package.
Technical Specifications
Parameters and characteristics for this part
| Specification | BD65491FV-E2 |
|---|---|
| Applications | Camera |
| Current - Output | 1.2 A |
| Function | Control and Power Stage, Driver - Fully Integrated |
| Half-Bridge Count | 2 |
| Interface | PWM |
| Motor Type - AC, DC | Brushed DC |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -25 °C |
| Output Configuration | Half Bridge |
| Package Length | 0.173 in |
| Package Name | 16-SSOP-B, 16-LSSOP |
| Package Width | 4.4 mm |
| Technology | DMOS |
| Voltage - Load (Max) | 16 V |
| Voltage - Load (Min) | 1.8 V |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 2.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
BD65491FV-E2 Flammability
SSOP-B16 Taping Spec
Datasheet
Basics of Thermal Resistance and Heat Dissipation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Factory Information
Solder Joint Rate and Thermal Resistance of Exposed Pad
Compliance with the ELV directive
Judgment Criteria of Thermal Evaluation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Two-Resistor Model for Thermal Simulation
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Thermal Resistance
Anti-Whisker formation
What Is Thermal Design
Impedance Characteristics of Bypass Capacitor
Design Guide and Example of Stencil for Exposed Pad
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Precautions When Measuring the Rear of the Package with a Thermocouple
Five Steps for Successful Thermal Design of IC
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
PCB Layout Thermal Design Guide