RFN5BM6STL
ObsoleteRohm Semiconductor
RECTIFIER, 600V, 5A, TO-252 ROHS COMPLIANT: YES
RFN5BM6STL
ObsoleteRohm Semiconductor
RECTIFIER, 600V, 5A, TO-252 ROHS COMPLIANT: YES
Description
General part information
RFN5BM6S Series
RFN5BM6S is the silicon epitaxial planar type Fast Recovery Diode.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFN5BM6STL |
|---|---|
| Current - Average Rectified (Io) | 5 A |
| Current - Reverse Leakage | 10 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | SC-63, DPAK (2 Leads + Tab), TO-252-3 |
| Package Name | TO-252 |
| Reverse Recovery Time (trr) | 50 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 600 V |
| Voltage - Forward (Vf) (Max) | 1.55 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Compliance of the RoHS directive
How to Create Symbols for PSpice Models
Package Dimensions
PCB Layout Thermal Design Guide
Impedance Characteristics of Bypass Capacitor
Report of SVHC under REACH Regulation
About Flammability of Materials
Part Explanation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Measurement Method and Usage of Thermal Resistance RthJC
Anti-Whisker formation - Diodes
Reliability Test Result
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Judgment Criteria of Thermal Evaluation
Power Loss and Thermal Design of Diodes
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Absolute Maximum Rating and Electrical Characteristics of Diodes
Method for Monitoring Switching Waveform
What is a Thermal Model? (Diode)
List of Diode Package Thermal Resistance
Notes for Calculating Power Consumption:Static Operation
How to Select Rectifier Diodes
Taping Information
How to Use LTspice® Models
What Is Thermal Design
Importance of Probe Calibration When Measuring Power: Deskew
Condition of Soldering / Land Pattern Reference
Basics of Thermal Resistance and Heat Dissipation
Explanation for Marking
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
RFN5BM6S Data Sheet
Moisture Sensitivity Level - Diodes
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Inner Structure
Notes for Temperature Measurement Using Thermocouples
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Select Reverse Current Protection Diodes for LDO Regulators
Diode Types and Applications
Precautions When Measuring the Rear of the Package with a Thermocouple
About Export Regulations
Two-Resistor Model for Thermal Simulation
How to Use LTspice® Models: Tips for Improving Convergence
ESD Data
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)