Specification	XC3S2000-4FGG676I

Mounting Type	Surface Mount
Number of Gates	2000000
Number of I/O	489
Number of LABs/CLBs	5120
Number of Logic Elements/Cells	46080
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	676-BGA
Package Length	27 mm
Package Name	676-FBGA
Package Width	27 mm
Total RAM Bits	737280 bits
Voltage - Supply (Maximum)	1.26 V
Voltage - Supply (Minimum)	1.14 V

XC3S2000 Series

Part	Number of Logic Elements/Cells	Package Length	Package Name	Package Width	Number of LABs/CLBs	Total RAM Bits	Operating Temperature (Max)	Operating Temperature (Min)	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Number of Gates	Package / Case	Number of I/O	Mounting Type
AMD / Xilinx XC3S2000-4FG900I	46080	31 mm	900-FBGA	31 mm	5120	737280 bits	100 °C	-40 °C	1.14 V	1.26 V	2000000	900-BBGA	565	Surface Mount
AMD / Xilinx XC3S2000-5FGG900C	46080	31 mm	900-FBGA	31 mm	5120	737280 bits	85 °C	0 °C	1.14 V	1.26 V	2000000	900-BBGA	565	Surface Mount
AMD / Xilinx XC3S2000-4FG456C	46080	23 mm	456-FBGA	23 mm	5120	737280 bits	85 °C	0 °C	1.14 V	1.26 V	2000000	456-BBGA	333	Surface Mount
AMD / Xilinx XC3S2000-5FGG676C	46080	27 mm	676-FBGA	27 mm	5120	737280 bits	85 °C	0 °C	1.14 V	1.26 V	2000000	676-BGA	489	Surface Mount
AMD / Xilinx XC3S2000-4FGG900C	46080	31 mm	900-FBGA	31 mm	5120	737280 bits	85 °C	0 °C	1.14 V	1.26 V	2000000	900-BBGA	565	Surface Mount
AMD / Xilinx XC3S2000-4FG676C	46080	27 mm	676-FBGA	27 mm	5120	737280 bits	85 °C	0 °C	1.14 V	1.26 V	2000000	676-BGA	489	Surface Mount
AMD / Xilinx XC3S2000-5FGG456C	46080	23 mm	456-FBGA	23 mm	5120	737280 bits	85 °C	0 °C	1.14 V	1.26 V	2000000	456-BBGA	333	Surface Mount
AMD / Xilinx XC3S2000-4FGG676I	46080	27 mm	676-FBGA	27 mm	5120	737280 bits	100 °C	-40 °C	1.14 V	1.26 V	2000000	676-BGA	489	Surface Mount
AMD / Xilinx XC3S2000-4FG456I	46080	23 mm	456-FBGA	23 mm	5120	737280 bits	100 °C	-40 °C	1.14 V	1.26 V	2000000	456-BBGA	333	Surface Mount

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