Specification	S9S08EL16F1MTL

A/D Channels	16 count
A/D Resolution (bits)	10 bit
Connectivity	I2C, SPI, LINbus, SCI
Core Processor	S08
Core Size (Bit Width)	8 Bit
EEPROM Size (Depth)	256
EEPROM Size (Width)	8 bit
Mounting Type	Surface Mount
Number of I/O	22
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	External
Package Length	0.173 in
Package Name	28-TSSOP
Package Width	4.4 mm
Peripherals	WDT, PWM, POR, LVD
Program Memory Depth	16 K
Program Memory Size	16 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	512
RAM Size Width	8 bit
Speed	40 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

S08EL Series

Part	Core Size (Bit Width)	Package Name	Package Length	Package Width	Program Memory Type	Peripherals	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	EEPROM Size (Width)	EEPROM Size (Depth)	RAM Size Depth	RAM Size Width	Program Memory Size	Program Memory Width	Program Memory Depth	Speed	Mounting Type	A/D Resolution (bits)	A/D Channels	Core Processor	Oscillator Type	Connectivity	Operating Temperature (Max)	Operating Temperature (Min)	Number of I/O
NXP USA Inc. S9S08EL32F1MTLR	8 Bit	28-TSSOP	0.173 in	4.4 mm	FLASH	LVD POR PWM WDT	2.7 V	5.5 V	8 bit	512	1 K	8 bit	32 KB	8 bit	32 K	40 MHz	Surface Mount	10 bit	16 count	S08	External	I2C LINbus SCI SPI	125 °C	-40 °C	22
NXP USA Inc. S9S08EL16F1MTL	8 Bit	28-TSSOP	0.173 in	4.4 mm	FLASH	LVD POR PWM WDT	2.7 V	5.5 V	8 bit	256	512	8 bit	16 KB	8 bit	16 K	40 MHz	Surface Mount	10 bit	16 count	S08	External	I2C LINbus SCI SPI	125 °C	-40 °C	22

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