Specification	C8051F973-A-GM

A/D Channels	43 count
A/D Resolution (bits)	10 bit
Connectivity	USART, I2C Slave, SPI, UART, SMBus, I2C
Core Processor	CIP-51™
Core Size (Bit Width)	8 Bit
Mounting Type	Surface Mount
Number of I/O	43
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	48-WFQFN Exposed Pad
Package Length	6 mm
Package Name	48-QFN
Package Width	6 mm
Peripherals	CapSense, POR, PWM, WDT, DMA
Program Memory Depth	16 K
Program Memory Size	16 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	4 K
RAM Size Width	8 bit
Speed	25 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.8 V

C8051F973 Series

Part	Core Processor	Package / Case	Number of I/O	Mounting Type	Core Size (Bit Width)	Program Memory Depth	Program Memory Width	Program Memory Size	Peripherals	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	A/D Resolution (bits)	A/D Channels	Speed	Package Length	Package Name	Package Width	RAM Size Depth	RAM Size Width	Program Memory Type	Operating Temperature (Max)	Operating Temperature (Min)	Connectivity	Oscillator Type
SILICON LABS C8051F973-A-GM	CIP-51™	48-WFQFN Exposed Pad	43	Surface Mount	8 Bit	16 K	8 bit	16 KB	CapSense DMA POR PWM WDT	3.6 V	1.8 V	10 bit	43 count	25 MHz	6 mm	48-QFN	6 mm	4 K	8 bit	FLASH	85 °C	-40 °C	I2C I2C Slave SMBus SPI UART USART	Internal
SILICON LABS C8051F973-A-GMR	CIP-51™	48-WFQFN Exposed Pad	43	Surface Mount	8 Bit	16 K	8 bit	16 KB	CapSense DMA POR PWM WDT	3.6 V	1.8 V	10 bit	43 count	25 MHz	6 mm	48-QFN	6 mm	4 K	8 bit	FLASH	85 °C	-40 °C	I2C I2C Slave SMBus SPI UART USART	Internal

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