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RGS80TS65DHRC11

RGS80TS65DHRC11

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Rohm Semiconductor

8ΜS SHORT-CIRCUIT TOLERANCE, 650V 40A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

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RGS80TS65DHRC11

RGS80TS65DHRC11

Active
Rohm Semiconductor

8ΜS SHORT-CIRCUIT TOLERANCE, 650V 40A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

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Description

General part information

RGS80 Series

The RGS80TSX2 is a 10µs SCSOA guaranteed IGBT, suitable for PFC, UPS, IH and Power Conditioner. The RGS series delivers low conduction loss that contributes to reducing size and to improving efficiency of applications.

Technical Specifications

Parameters and characteristics for this part

SpecificationRGS80TS65DHRC11
Current - Collector (Ic) (Max)73 A
Current - Collector Pulsed (Icm)120 A
Gate Charge48 nC
IGBT TypeTrench Field Stop
Input TypeStandard
Mounting TypeThrough Hole
Operating Temperature (Max)175 °C
Operating Temperature (Min)-40 °C
Package / CaseTO-247-3
Package NameTO-247N
Power - Max272 W
Reverse Recovery Time (trr)103 ns
Switching Energy (Off)1.03 mJ
Switching Energy (On)1.05 mJ
Td (off) @ 25°C112 ns
Td (on) @ 25°C37 ns
Test Condition Current40 A
Test Condition Resistance10 Ohm
Test Condition Voltage400 V
Test Condition Voltage (Secondary)15 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
Method for Monitoring Switching Waveform
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Create Symbols for PSpice Models
Compliance of the ELV directive
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Importance of Probe Calibration When Measuring Power: Deskew
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
Simulation Guide for PTC Heater Thermal Simulation (ROHM Solution Simulator)
Types and Features of Transistors
Condition of Soldering
Estimation of switching losses in IGBTs operating with resistive load
Moisture Sensitivity Level
Notes for Temperature Measurement Using Thermocouples
What is a Thermal Model? (IGBT)
The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level
4 Steps for Successful Thermal Designing of Power Devices
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Impedance Characteristics of Bypass Capacitor
About Export Administration Regulations (EAR)
Calculation of Power Dissipation in Switching Circuit
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Taping Information
Explanation for Marking
Measurement Method and Usage of Thermal Resistance RthJC
Inner Structure
Reliability Test Result
Judgment Criteria of Thermal Evaluation
How to Use LTspice&reg; Models: Tips for Improving Convergence
PCB Layout Thermal Design Guide
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
How to Use LTspice&reg; Models
Package Dimensions
About Flammability of Materials
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Precautions When Measuring the Rear of the Package with a Thermocouple
Precautions for Thermal Resistance of Insulation Sheet
What Is Thermal Design
Notes for Calculating Power Consumption:Static Operation
Part Explanation
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules
Anti-Whisker formation
Basics of Thermal Resistance and Heat Dissipation
Two-Resistor Model for Thermal Simulation