
74LVC1G08GM,115
ActiveNexperia USA Inc.
AND GATE, SINGLE, 2 INPUT, 6 PINS, XSON, 74LVC1G08

74LVC1G08GM,115
ActiveNexperia USA Inc.
AND GATE, SINGLE, 2 INPUT, 6 PINS, XSON, 74LVC1G08
Description
General part information
74LVC1G08GM Series
The 74LVC1G08 is a single 2-input AND gate. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V applications.
Technical Specifications
Parameters and characteristics for this part
| Specification | 74LVC1G08GM,115 |
|---|---|
| Current - Output High | 32 mA |
| Current - Output Low | 32 mA |
| Current - Quiescent (Max) | 4 µA |
| Input Logic Level - High (Max) | 2 V |
| Input Logic Level - High (Min) | 1.7 V |
| Input Logic Level - Low (Max) | 0.8 V |
| Input Logic Level - Low (Min) | 0.7 V |
| Logic Type | AND Gate |
| Max CL | 50 pF |
| Max Propagation Delay | 4 ns |
| Mounting Type | Surface Mount |
| Number of Circuits | 1 |
| Number of Inputs | 2 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 6-XFDFN |
| Package Length | 1.45 mm |
| Package Name | 6-XSON, SOT886 |
| Package Width | 1 mm |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.65 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Reflow soldering profile
plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body
Pin FMEA for LVC family
plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body
PicoGate Logic footprints
MicroPak leadless logic portfolio guide
74LVC1G08GM Nexperia Product Reliability
plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body
Nexperia package poster
XSON6; Reel pack for SMD, 7''; Q3/T4 product orientation
XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation
MAR_SOT886 Topmark