RBR10T40ANZC9
ActiveRohm Semiconductor
LOW VF, 40V, 10A, ITO-220AB, SCHOTTKY BARRIER DIODE
RBR10T40ANZC9
ActiveRohm Semiconductor
LOW VF, 40V, 10A, ITO-220AB, SCHOTTKY BARRIER DIODE
Description
General part information
RBR10T40ANZ Series
RBR10T40ANZ is Low VFSchottky Barrier Diode for Switching power supply.
Technical Specifications
Parameters and characteristics for this part
| Specification | RBR10T40ANZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 5 A |
| Current - Reverse Leakage | 120 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 40 V |
| Voltage - Forward (Vf) (Max) | 620 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
About Flammability of Materials
Constitution Materials List
Precautions When Measuring the Rear of the Package with a Thermocouple
ESD Data
Moisture Sensitivity Level - Diodes
About Export Regulations
Taping Information
How to Select Rectifier Diodes
Compliance of the RoHS directive
Inner Structure
Absolute Maximum Rating and Electrical Characteristics of Diodes
Part Explanation
Diode Selection Method for Asynchronous Converter
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Anti-Whisker formation - Diodes
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Diode Types and Applications
What is a Thermal Model? (Diode)
Notes for Temperature Measurement Using Thermocouples
Method for Monitoring Switching Waveform
Certificate of not containing SVHC under REACH Regulation
How to Select Reverse Current Protection Diodes for LDO Regulators
Explanation for Marking
How to Use LTspice® Models: Tips for Improving Convergence
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Notes for Calculating Power Consumption:Static Operation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Condition of Soldering / Land Pattern Reference
Two-Resistor Model for Thermal Simulation
What Is Thermal Design
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Impedance Characteristics of Bypass Capacitor
Importance of Probe Calibration When Measuring Power: Deskew
Measurement Method and Usage of Thermal Resistance RthJC
List of Diode Package Thermal Resistance
How to Create Symbols for PSpice Models
How to Use the Thermal Resistance and Thermal Characteristics Parameters
RBR10T40ANZ Data Sheet
Reliability Test Result
Judgment Criteria of Thermal Evaluation
Power Loss and Thermal Design of Diodes
PCB Layout Thermal Design Guide
Basics of Thermal Resistance and Heat Dissipation
How to Use LTspice® Models
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Package Dimensions
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment