Specification	MC9S08QG4CDNE

A/D Channels	4 count
A/D Resolution (bits)	10 bit
Connectivity	SCI, SPI, I2C
Core Processor	S08
Core Size (Bit Width)	8 Bit
Mounting Type	Surface Mount
Number of I/O	4
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package Length	0.154 in
Package Name	8-SOIC
Package Width	3.9 mm
Peripherals	WDT, PWM, POR, LVD
Program Memory Depth	4 K
Program Memory Size	4 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	256
RAM Size Width	8 bit
Speed	20 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.8 V

S08QG Series

Part	Core Size (Bit Width)	Program Memory Depth	Program Memory Width	Program Memory Size	Speed	Mounting Type	RAM Size Width	RAM Size Depth	Number of I/O	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Core Processor	Package Name	Peripherals	A/D Channels	A/D Resolution (bits)	Program Memory Type	Oscillator Type	Connectivity	Package Length	Package Width	Operating Temperature (Max)	Operating Temperature (Min)
NXP USA Inc. MC9S08QG4CDNE	8 Bit	4 K	8 bit	4 KB	20 MHz	Surface Mount	8 bit	256	4	3.6 V	1.8 V	S08	8-SOIC	LVD POR PWM WDT	4 count	10 bit	FLASH	Internal	I2C SCI SPI	0.154 in	3.9 mm	85 °C	-40 °C

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