Specification	CYT3DLBBEBQ1BZSGS

Connectivity	WDT, LVD, I2S, DMA, Temp Sensor
Core Configuration	Dual-Core
Core Processor	ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size (Bit Width)	32 Bit
EEPROM Size (Depth)	128 K
EEPROM Size (Width)	8 bit
Mounting Type	Surface Mount
Number of I/O	135
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Package / Case	272-LFBGA, 272-BGA
Package Length	16 mm
Package Name	272-BGA
Package Width	16 mm
Peripherals	DMA, I2S, WDT, LVD, Temp Sensor
Program Memory Depth	4.063 M
Program Memory Size	4.063 MB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	384 K
RAM Size Width	8 bit
Speed	240 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

CYT3DLB Series

Part	Operating Temperature (Max)	Operating Temperature (Min)	Number of I/O	RAM Size Width	RAM Size Depth	Program Memory Type	Package Name	Package Length	Package Width	Program Memory Depth	Program Memory Size	Program Memory Width	EEPROM Size (Width)	EEPROM Size (Depth)	Package / Case	Speed	Core Processor	Connectivity	Core Size (Bit Width)	Core Configuration	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Peripherals	Mounting Type
INFINEON CYT3DLBBGBQ1BZSGS	105 °C	-40 °C	135	8 bit	384 K	FLASH	272-BGA	16 mm	16 mm	4.063 M	4.063 MB	8 bit	8 bit	128 K	272-BGA 272-LFBGA	240 MHz	ARM® Cortex®-M0+ ARM® Cortex®-M7F	DMA I2S LVD Temp Sensor WDT	32 Bit	Dual-Core	2.7 V	5.5 V	DMA I2S LVD Temp Sensor WDT	Surface Mount
INFINEON CYT3DLBBEBQ1BZSGS	105 °C	-40 °C	135	8 bit	384 K	FLASH	272-BGA	16 mm	16 mm	4.063 M	4.063 MB	8 bit	8 bit	128 K	272-BGA 272-LFBGA	240 MHz	ARM® Cortex®-M0+ ARM® Cortex®-M7F	DMA I2S LVD Temp Sensor WDT	32 Bit	Dual-Core	2.7 V	5.5 V	DMA I2S LVD Temp Sensor WDT	Surface Mount

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources