Specification	XC3S1500-4FGG676C

Mounting Type	Surface Mount
Number of Gates	1500000
Number of I/O	487
Number of LABs/CLBs	3328
Number of Logic Elements/Cells	29952
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	0 °C
Package / Case	676-BGA
Package Length	27 mm
Package Name	676-FBGA
Package Width	27 mm
Total RAM Bits	589824 bits
Voltage - Supply (Maximum)	1.26 V
Voltage - Supply (Minimum)	1.14 V

XC3S1500 Series

Part	Number of Gates	Package / Case	Total RAM Bits	Number of I/O	Number of LABs/CLBs	Package Length	Package Name	Package Width	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Mounting Type	Number of Logic Elements/Cells	Operating Temperature (Max)	Operating Temperature (Min)
AMD / Xilinx XC3S1500-4FGG676I	1500000	676-BGA	589824 bits	487	3328	27 mm	676-FBGA	27 mm	1.14 V	1.26 V	Surface Mount	29952	100 °C	-40 °C
AMD / Xilinx XC3S1500-4FGG676C	1500000	676-BGA	589824 bits	487	3328	27 mm	676-FBGA	27 mm	1.14 V	1.26 V	Surface Mount	29952	85 °C	0 °C
AMD / Xilinx XC3S1500-5FGG456C	1500000	456-BBGA	589824 bits	333	3328	23 mm	456-FBGA	23 mm	1.14 V	1.26 V	Surface Mount	29952	85 °C	0 °C
AMD / Xilinx XC3S1500-4FG676C	1500000	676-BGA	589824 bits	487	3328	27 mm	676-FBGA	27 mm	1.14 V	1.26 V	Surface Mount	29952	85 °C	0 °C
AMD / Xilinx XC3S1500-4FGG456I	1500000	456-BBGA	589824 bits	333	3328	23 mm	456-FBGA	23 mm	1.14 V	1.26 V	Surface Mount	29952	100 °C	-40 °C
AMD / Xilinx XC3S1500-4FGG456C	1500000	456-BBGA	589824 bits	333	3328	23 mm	456-FBGA	23 mm	1.14 V	1.26 V	Surface Mount	29952	85 °C	0 °C

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