K66X-A26P-N30

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Kycon, Inc.

CONN D-SUB HD PLG 26POS R/A SLDR

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Active

Kycon, Inc.

CONN D-SUB HD PLG 26POS R/A SLDR

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	K66X-A26P-N30	K66X-A26 Series

Backset Spacing	8.89 mm	8.89 mm
Backset Spacing	0.35 in	0.35 in
Color	Black	Black
Connector Style	High Density, D-Sub	High Density, D-Sub
Connector Type	Plug, Male Pins	Receptacle, Female Sockets, Plug, Male Pins
Contact Finish	Gold	Gold
Contact Finish Thickness	0.76 Ám	0.76 Ám
Contact Finish Thickness	30 Áin	30 Áin
Contact Finish Thickness	-	Flash
Contact Material	Brass	Phosphor Bronze, Brass
Contact Type	Signal	Signal
Current Rating (Amps)	1.5 A	1.5 A
Dielectric Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Features	Grounding Indents, Board Lock	Grounding Indents, Board Lock
Flange Feature	Housing/Shell (4-40)	Female Screwlock (4-40), Mating Side, Housing/Shell (4-40)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole, Right Angle	Through Hole, Right Angle
Number of Positions	26	26
Number of Rows	3	3
Operating Temperature [Max]	75 ░C	75 ░C
Operating Temperature [Min]	-55 °C	-55 °C
Shell Material, Finish	Nickel Plated, Steel	Nickel Plated, Steel
Shell Size, Connector Layout	2	2
Shell Size, Connector Layout	(DA, A) High Density	(DA, A) High Density
Termination	Solder	Solder
Voltage Rating	29 VAC	29 VAC

CONN D-SUB HD RCPT 26P R/A SLDR

Part	Connector Style	Shell Size, Connector Layout	Shell Size, Connector Layout	Backset Spacing	Backset Spacing	Operating Temperature [Max]	Operating Temperature [Min]	Dielectric Material	Shell Material, Finish	Contact Finish Thickness	Contact Finish Thickness	Contact Finish	Contact Material	Number of Positions	Material Flammability Rating	Color	Connector Type	Voltage Rating	Mounting Type	Contact Type	Current Rating (Amps)	Number of Rows	Flange Feature	Termination	Contact Finish Thickness	Features
Kycon, Inc. K66X-A26S-NJ30	D-Sub, High Density	2	(DA, A) High Density	8.89 mm	0.35 in	75 ░C	-55 °C	Polybutylene Terephthalate (PBT), Glass Filled	Nickel Plated, Steel	0.76 Ám	30 Áin	Gold	Phosphor Bronze	26	UL94 V-0	Black	Receptacle, Female Sockets	29 VAC	Through Hole, Right Angle	Signal	1.5 A	3	Female Screwlock (4-40), Mating Side	Solder
Kycon, Inc. K66X-A26S-N	D-Sub, High Density	2	(DA, A) High Density	8.89 mm	0.35 in	75 ░C	-55 °C	Polybutylene Terephthalate (PBT), Glass Filled	Nickel Plated, Steel			Gold	Phosphor Bronze	26	UL94 V-0	Black	Receptacle, Female Sockets	29 VAC	Through Hole, Right Angle	Signal	1.5 A	3	Housing/Shell (4-40)	Solder	Flash
Kycon, Inc. K66X-A26P-N30	D-Sub, High Density	2	(DA, A) High Density	8.89 mm	0.35 in	75 ░C	-55 °C	Polybutylene Terephthalate (PBT), Glass Filled	Nickel Plated, Steel	0.76 Ám	30 Áin	Gold	Brass	26	UL94 V-0	Black	Male Pins, Plug	29 VAC	Through Hole, Right Angle	Signal	1.5 A	3	Housing/Shell (4-40)	Solder		Board Lock, Grounding Indents

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1050	$ 7.31