Specification	LFSCM3GA15EP1-5F900I

Mounting Type	Surface Mount
Number of I/O	300
Number of LABs/CLBs	3750
Number of Logic Elements/Cells	15000
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Package / Case	900-BBGA
Package Length	31 mm
Package Name	900-FPBGA
Package Width	31 mm
Total RAM Bits	1054720 bits
Voltage - Supply (Maximum)	1.26 V
Voltage - Supply (Minimum)	0.95 V

LFSCM3GA15 Series

Part	Package / Case	Number of LABs/CLBs	Operating Temperature (Min)	Operating Temperature (Max)	Number of Logic Elements/Cells	Total RAM Bits	Package Width	Package Name	Package Length	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Number of I/O	Mounting Type
Lattice Semiconductor Corporation LFSCM3GA15EP1-5F900I	900-BBGA	3750	-40 °C	105 °C	15000	1054720 bits	31 mm	900-FPBGA	31 mm	0.95 V	1.26 V	300	Surface Mount
Lattice Semiconductor Corporation LFSCM3GA15EP1-6FN900C	900-BBGA	3750	0 °C	85 °C	15000	1054720 bits	31 mm	900-FPBGA	31 mm	0.95 V	1.26 V	300	Surface Mount
Lattice Semiconductor Corporation LFSCM3GA15EP1-6FN900I	900-BBGA	3750	-40 °C	105 °C	15000	1054720 bits	31 mm	900-FPBGA	31 mm	0.95 V	1.26 V	300	Surface Mount
Lattice Semiconductor Corporation LFSCM3GA15EP1-5F256I	256-BGA	3750	-40 °C	105 °C	15000	1054720 bits	17 mm	256-FPBGA	17 mm	0.95 V	1.26 V	139	Surface Mount
Lattice Semiconductor Corporation LFSCM3GA15EP1-5F256C	256-BGA	3750	0 °C	85 °C	15000	1054720 bits	17 mm	256-FPBGA	17 mm	0.95 V	1.26 V	139	Surface Mount
Lattice Semiconductor Corporation LFSCM3GA15EP1-5FN900I	900-BBGA	3750	-40 °C	105 °C	15000	1054720 bits	31 mm	900-FPBGA	31 mm	0.95 V	1.26 V	300	Surface Mount

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