
PBSS4130PANP,115
ActiveNexperia USA Inc.
TRANS GP BJT NPN/PNP 30V 1A 2000MW AUTOMOTIVE AEC-Q101 6-PIN HUSON EP T/R

PBSS4130PANP,115
ActiveNexperia USA Inc.
TRANS GP BJT NPN/PNP 30V 1A 2000MW AUTOMOTIVE AEC-Q101 6-PIN HUSON EP T/R
Description
General part information
PBSS4130 Series
NPN low VCEsatBreakthrough In Small Signal (BISS) transistor in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Technical Specifications
Parameters and characteristics for this part
| Specification | PBSS4130PANP,115 |
|---|---|
| Current - Collector (Ic) (Max) | 1 A |
| Current - Collector Cutoff (Max) | 100 nA |
| DC Current Gain (hFE) (Min) | 210 |
| Frequency - Transition | 165 MHz |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| NPN Count | 1 |
| Operating Temperature | 150 °C |
| Package / Case | 6-UFDFN Exposed Pad |
| Package Length | 2 mm |
| Package Name | 6-HUSON |
| Package Width | 2 mm |
| PNP Count | 1 |
| Power - Max | 510 mW |
| Qualification | AEC-Q100 |
| Transistor Type | PNP, NPN |
| Vce Saturation (Max) | 100 mV |
| Voltage - Collector Emitter Breakdown (Max) | 30 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
plastic, leadless thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
Nexperia package poster
plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
DFN2020-6; Reel pack for SMD, 7''; Q2/T3 product orientation
Questions about package outline drawings
PBSS4130PANP Nexperia Product Reliability
Reflow soldering profile