
WAVE-35-21
ActiveWakefield Thermal Solutions
LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

WAVE-35-21
ActiveWakefield Thermal Solutions
LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES
Description
General part information
WAVE-35 Series
Heat Sink BGA Aluminum Alloy Board Level
Technical Specifications
Parameters and characteristics for this part
| Specification | WAVE-35-21 |
|---|---|
| Attachment Method | Clip |
| Fin Height | 0.827 in |
| Length | 1.378 in |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
| Package Cooled | BGA |
| Shape | Square, Angled Fins |
| Thermal Resistance | 2.11 °C/W |
| Type | Board Level |
| Width | 1.378 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources