Specification	C8051T631-GMR

Connectivity	UART, SMBus (2-Wire/I2C), SPI, USART
Core Processor	8051
Core Size (Bit Width)	8 Bit
Mounting Type	Surface Mount
Number of I/O	17
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	20-VFQFN Exposed Pad
Package Length	4 mm
Package Name	20-QFN
Package Width	4 mm
Peripherals	WDT, POR, PWM
Program Memory Depth	8 K
Program Memory Size	8 KB
Program Memory Type	OTP
Program Memory Width	8 bit
RAM Size Depth	768
RAM Size Width	8 bit
Speed	25 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.8 V

C8051T631 Series

Part	Program Memory Depth	Program Memory Width	Program Memory Size	Connectivity	Mounting Type	Package / Case	Package Width	Package Name	Package Length	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	RAM Size Width	RAM Size Depth	Peripherals	Oscillator Type	Number of I/O	Program Memory Type	Core Size (Bit Width)	Core Processor	Operating Temperature (Max)	Operating Temperature (Min)	Speed
SILICON LABS C8051T631-GM	8 K	8 bit	8 KB	SMBus (2-Wire/I2C) SPI UART USART	Surface Mount	20-VFQFN Exposed Pad	4 mm	20-QFN	4 mm	3.6 V	1.8 V	8 bit	768	POR PWM WDT	Internal	17	OTP	8 Bit	8051	85 °C	-40 °C	25 MHz
SILICON LABS C8051T631-GMR	8 K	8 bit	8 KB	SMBus (2-Wire/I2C) SPI UART USART	Surface Mount	20-VFQFN Exposed Pad	4 mm	20-QFN	4 mm	3.6 V	1.8 V	8 bit	768	POR PWM WDT	Internal	17	OTP	8 Bit	8051	85 °C	-40 °C	25 MHz

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources

No documents available