| Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 4 | C DC High Density | 62 | Solder | 3 | Male Pins Plug | Grounding Indents | 3 A | UL94 V-0 | Mating Side (M3) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | | | |
| Board Edge Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 2 | A DA High Density | 26 | Solder | 3 | Male Pins Plug | Board Lock Grounding Indents | 3 A | UL94 V-0 | Housing Shell (4-40) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | 8 µin | | |
| Board Edge Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 4 | C DC High Density | 62 | Solder | 3 | Male Pins Plug | Board Lock Grounding Indents | 3 A | UL94 V-0 | Housing Shell (4-40) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | 8 µin | | |
| Board Edge Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 3 | B DB High Density | 44 | Solder | 3 | Male Pins Plug | Board Lock Grounding Indents | 3 A | UL94 V-0 | Housing Shell (4-40) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | 8 µin | | |
| Board Edge Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 1 | DE E High Density | 15 | Solder | 3 | Male Pins Plug | Board Lock Grounding Indents | 3 A | UL94 V-0 | Housing Shell (4-40) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | 8 µin | | |
| Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 1 | DE E High Density | 15 | Solder | 3 | Male Pins Plug | Grounding Indents | 3 A | UL94 V-0 | Mating Side (M3) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | | | |
| Board Edge Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 3 | B DB High Density | 44 | Solder | 3 | Male Pins Plug | Grounding Indents Mounting Brackets | 3 A | UL94 V-0 | Mating Side (4-40) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | 0 | Flash | Flash |
| Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 2 | A DA High Density | 26 | Solder | 3 | Male Pins Plug | Grounding Indents | 3 A | UL94 V-0 | Mating Side (M3) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | | | |
| Board Edge Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 4 | C DC High Density | 62 | Solder | 3 | Male Pins Plug | Grounding Indents Mounting Brackets | 3 A | UL94 V-0 | Mating Side (4-40) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | 0 | Flash | Flash |
| Right Angle Through Hole | D-Sub High Density | Signal | Tin Plated | Steel | Gold | 0.314 in | 3 | B DB High Density | 44 | Solder | 3 | Male Pins Plug | Grounding Indents | 3 A | UL94 V-0 | Mating Side (M3) | IP20 | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | Black | 125 °C | -55 °C | Copper Alloy | Machined | | | |