AWHP0016100851NH00

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Pulse Electronics

RF INDUCTORS - SMD CHILISIN RF INDUCTOR WIRE WOUND-STD

AWHP0016100851NH00

Active

Pulse Electronics

RF INDUCTORS - SMD CHILISIN RF INDUCTOR WIRE WOUND-STD

Description Specifications Series Pricing CAD Documents

Description

General part information

AWHP Series

RF Inductors - SMD Chilisin RF inductor Wire Wound-STD

Technical Specifications

Parameters and characteristics for this part

Specification	AWHP0016100851NH00

Current Rating	660 mA
DC Resistance (DCR) (Max)	280 mOhm
Frequency - Self Resonant	2.3 GHz
Height - Seated (Max)	0.04 in
Inductance	51 nH
Inductance Frequency - Test	200 MHz
Material - Core	Ceramic
Mounting Type	Surface Mount
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package / Case	0603 (1608 Metric)
Package Name	0603
Q	42
Ratings	AEC-Q200
Shielding	Unshielded
Size / Dimension Length	0.063 in
Size / Dimension Width	0.039 in
Tolerance	3 %
Type	Drum Core, Wirewound

AWHP Series

RF Inductors - SMD Chilisin RF inductor Wire Wound-STD

Part	Size / Dimension Length	Size / Dimension Width	Type	Inductance Frequency - Test	Material - Core	Q	Mounting Type	Shielding	Height - Seated (Max)	DC Resistance (DCR) (Max)	Package Name	Operating Temperature (Max)	Operating Temperature (Min)	Frequency - Self Resonant	Package / Case	Tolerance	Ratings	Inductance	Current Rating
Pulse Electronics AWHP0011070620NG00	0.043 in	0.028 in	Drum Core Wirewound	250 MHz	Ceramic	30	Surface Mount	Unshielded	0.026 in	220 mOhm	0402	125 °C	-40 °C	3.5 GHz	0402 (1005 Metric)	2 %	AEC-Q200	20 nH	780 mA
Pulse Electronics AWHP0016100851NH00	0.063 in	0.039 in	Drum Core Wirewound	200 MHz	Ceramic	42	Surface Mount	Unshielded	0.04 in	280 mOhm	0603	125 °C	-40 °C	2.3 GHz	0603 (1608 Metric)	3 %	AEC-Q200	51 nH	660 mA
Pulse Electronics AWHP001107063N9G00	0.043 in	0.028 in	Drum Core Wirewound	250 MHz	Ceramic	28	Surface Mount	Unshielded	0.026 in	65 mOhm	0402	125 °C	-40 °C	9.5 GHz	0402 (1005 Metric)	2 %	AEC-Q200	3.9 nH	1.7 A
Pulse Electronics AWHP0011070633NH00	0.043 in	0.028 in	Drum Core Wirewound	250 MHz	Ceramic	30	Surface Mount	Unshielded	0.026 in	380 mOhm	0402	125 °C	-40 °C	2.8 GHz	0402 (1005 Metric)	3 %	AEC-Q200	33 nH	490 mA
Pulse Electronics AWHP001107062N2C00	0.043 in	0.028 in	Drum Core Wirewound	250 MHz	Ceramic	25	Surface Mount	Unshielded	0.026 in	45 mOhm	0402	125 °C	-40 °C	15.1 GHz	0402 (1005 Metric)	0.2 nH	AEC-Q200	2.2 nH	2.1 A
Pulse Electronics AWHP0016100822NJ00	0.063 in	0.039 in	Drum Core Wirewound	250 MHz	Ceramic	40	Surface Mount	Unshielded	0.04 in	195 mOhm	0603	125 °C	-40 °C	3.15 GHz	0603 (1608 Metric)	5 %	AEC-Q200	22 nH	0.85 A
Pulse Electronics AWHP0011070615NG00	0.043 in	0.028 in	Drum Core Wirewound	250 MHz	Ceramic	30	Surface Mount	Unshielded	0.026 in	130 mOhm	0402	125 °C	-40 °C	3.9 GHz	0402 (1005 Metric)	2 %	AEC-Q200	15 nH	1.1 A
Pulse Electronics AWHP001107066N8G00	0.043 in	0.028 in	Drum Core Wirewound	250 MHz	Ceramic	25	Surface Mount	Unshielded	0.026 in	95 mOhm	0402	125 °C	-40 °C	5.8 GHz	0402 (1005 Metric)	2 %	AEC-Q200	6.8 nH	1.5 A
Pulse Electronics AWHP0016100839NH00	0.063 in	0.039 in	Drum Core Wirewound	250 MHz	Ceramic	48	Surface Mount	Unshielded	0.04 in	190 mOhm	0603	125 °C	-40 °C	2.45 GHz	0603 (1608 Metric)	3 %	AEC-Q200	39 nH	0.68 A
Pulse Electronics AWHP0011070651NH00	0.043 in	0.028 in	Drum Core Wirewound	250 MHz	Ceramic	30	Surface Mount	Unshielded	0.026 in	980 mOhm	0402	125 °C	-40 °C	2.3 GHz	0402 (1005 Metric)	3 %	AEC-Q200	51 nH	360 mA

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

AWHP0016100851NH00 | Datasheet