Specification	XC2S600E-6FG456Q

Mounting Type	Surface Mount
Number of Gates	600000
Number of I/O	329
Number of LABs/CLBs	3456
Number of Logic Elements/Cells	15552
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package / Case	456-BBGA
Package Length	23 mm
Package Name	456-FBGA
Package Width	23 mm
Total RAM Bits	294912 bits
Voltage - Supply (Maximum)	1.89 V
Voltage - Supply (Minimum)	1.71 V

XC2S600E Series

Part	Operating Temperature (Max)	Operating Temperature (Min)	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Number of Logic Elements/Cells	Mounting Type	Package / Case	Number of LABs/CLBs	Total RAM Bits	Package Width	Package Name	Package Length	Number of Gates	Number of I/O
AMD / Xilinx XC2S600E-6FGG456C	85 °C	0 °C	1.89 V	1.71 V	15552	Surface Mount	456-BBGA	3456	294912 bits	23 mm	456-FBGA	23 mm	600000	329
AMD / Xilinx XC2S600E-6FG456Q	125 °C	-40 °C	1.89 V	1.71 V	15552	Surface Mount	456-BBGA	3456	294912 bits	23 mm	456-FBGA	23 mm	600000	329

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