XCKU3P-2FFVA676E

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AMD

IC FPGA 256 I/O 676FCBGA

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Active

AMD

IC FPGA 256 I/O 676FCBGA

Technical Specifications

Parameters and characteristics for this part

Specification	XCKU3P-2FFVA676E

Mounting Type	Surface Mount
Number of I/O	256
Number of LABs/CLBs	20340
Number of Logic Elements/Cells	355950
Operating Temperature [Max]	100 °C
Operating Temperature [Min]	0 °C
Supplier Device Package	676-FCBGA (27x27)
Total RAM Bits	31641600 Bits
Voltage - Supply [Max]	0.876 V
Voltage - Supply [Min]	0.825 V

Part	Mounting Type	Package / Case	Number of Logic Elements/Cells	Total RAM Bits	Number of I/O	Operating Temperature [Max]	Operating Temperature [Min]	Voltage - Supply [Min]	Voltage - Supply [Max]	Number of LABs/CLBs	Supplier Device Package
AMD XCKU3P-1SFVB784I	Surface Mount	784-BFBGA FCBGA	355950	31641600 Bits	256	100 °C	-40 C	0.825 V	0.876 V	20340
AMD XCKU3P-2FFVA676E	Surface Mount		355950	31641600 Bits	256	100 °C	0 °C	0.825 V	0.876 V	20340	676-FCBGA (27x27)
AMD XCKU3P-L1SFVB784I	Surface Mount	784-BFBGA FCBGA	355950	31641600 Bits	256	100 °C	-40 C	0.698 V	0.876 V	20340
AMD XCKU3P-1FFVD900E	Surface Mount	900-BBGA FCBGA	355950	31641600 Bits	304	100 °C	0 °C	0.825 V	0.876 V	20340	900-FCBGA (31x31)
AMD XCKU3P-2FFVD900I	Surface Mount	900-BBGA FCBGA	355950	31641600 Bits	304	100 °C	-40 C	0.825 V	0.876 V	20340	900-FCBGA (31x31)
AMD XCKU3P-2FFVB676E	Surface Mount		355950	31641600 Bits	280	100 °C	0 °C	0.825 V	0.876 V	20340	676-FCBGA (27x27)
AMD XCKU3P-L1FFVD900I	Surface Mount	900-BBGA FCBGA	355950	31641600 Bits	304	100 °C	-40 C	0.698 V	0.876 V	20340	900-FCBGA (31x31)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 2033.75

General part information

Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 256 31641600 355950 676-BBGA, FCBGA

Technical documentation and resources

No documents available