RB088BM200FHHTL
ActiveRohm Semiconductor
SCHOTTKY RECTIFIER, 200V, 10A, TO-252 ROHS COMPLIANT: YES
RB088BM200FHHTL
ActiveRohm Semiconductor
SCHOTTKY RECTIFIER, 200V, 10A, TO-252 ROHS COMPLIANT: YES
Description
General part information
RB088BM200FHH Series
RB088BM200FHH is a ultra low IRschottky barrier diode, suitable for Switching power supply. It is a highly reliable product for automotive.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB088BM200FHHTL |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 5 A |
| Current - Reverse Leakage | 7 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 175 °C |
| Package / Case | SC-63, DPAK (2 Leads + Tab), TO-252-3 |
| Package Name | TO-252 |
| Qualification | AEC-Q101 |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 200 V |
| Voltage - Forward (Vf) (Max) | 880 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
RB088BM200FHHTL | Datasheet
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Basics of Thermal Resistance and Heat Dissipation
Absolute Maximum Rating and Electrical Characteristics of Diodes
θ<sub>JA</sub> and Ψ<sub>JT</sub>
List of Diode Package Thermal Resistance
Report of SVHC under REACH Regulation
Anti-Whisker formation - Diodes
Diode Selection Method for Asynchronous Converter
How to Select Reverse Current Protection Diodes for LDO Regulators
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Part Explanation
Judgment Criteria of Thermal Evaluation
What is a Thermal Model? (Diode)
How to Use LTspice® Models
About Export Regulations
Taping Information
Condition of Soldering / Land Pattern Reference
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
How to Use LTspice® Models: Tips for Improving Convergence
Notes for Temperature Measurement Using Thermocouples
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Impedance Characteristics of Bypass Capacitor
Importance of Probe Calibration When Measuring Power: Deskew
Measurement Method and Usage of Thermal Resistance RthJC
Method for Monitoring Switching Waveform
What Is Thermal Design
Power Loss and Thermal Design of Diodes
PCB Layout Thermal Design Guide
Package Dimensions
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
How to Select Rectifier Diodes
Notes for Calculating Power Consumption:Static Operation
Compliance of the RoHS directive
Precautions When Measuring the Rear of the Package with a Thermocouple
Moisture Sensitivity Level - Diodes
Diode Types and Applications
Explanation for Marking
θ<sub>JC</sub> and Ψ<sub>JT</sub>
About Flammability of Materials
Two-Resistor Model for Thermal Simulation
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials