
BD41030FJ-CGE2
ActiveRohm Semiconductor
LIN TRANSCEIVER, AEC-Q100, 20KBPS, SOP-8

BD41030FJ-CGE2
ActiveRohm Semiconductor
LIN TRANSCEIVER, AEC-Q100, 20KBPS, SOP-8
Description
General part information
BD41030 Series
BD41030FJ-C is the best transceiver for BUS system which need LIN (Local Interconnect Network) master and slave protocol. BD41030FJ-C is available in small SOP package and low standby electricity consumption in sleep mode.
Technical Specifications
Parameters and characteristics for this part
| Specification | BD41030FJ-CGE2 |
|---|---|
| Data Rate | 20 kbps |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Number of Drivers | 1 |
| Number of Receivers | 1 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.154 in |
| Package Name | 8-SOP-J, 8-SOIC |
| Package Width | 3.9 mm |
| Protocol | LINbus |
| Qualification | AEC-Q100 |
| Type | Transceiver |
| Voltage - Supply (Maximum) | 27 VDC |
| Voltage - Supply (Minimum) | 5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Five Steps for Successful Thermal Design of IC
Anti-Whisker formation
Factory Information
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
SOP-J8 Package Information
Solder Joint Rate and Thermal Resistance of Exposed Pad
Impedance Characteristics of Bypass Capacitor
UL94 Flame Classifications of Mold Compound
What Is Thermal Design
Compliance with the ELV directive
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Basics of Thermal Resistance and Heat Dissipation
Design Guide and Example of Stencil for Exposed Pad
Thermal Resistance
Datasheet
Product Change Notice EN
AEC-Q101 Automotive Requirements
SOP-J8 Dry Pack Taping Spec