74AHC30PW-Q100J

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Nexperia USA Inc.

IC GATE NAND 1CH 8-INP 14TSSOP

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74AHC30PW-Q100J

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Nexperia USA Inc.

IC GATE NAND 1CH 8-INP 14TSSOP

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Description Specifications Series Pricing CAD Documents

Description

General part information

74AHC30PW-Q100 Series

The 74AHC30-Q100; 74AHCT30-Q100 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A.

Technical Specifications

Parameters and characteristics for this part

Specification	74AHC30PW-Q100J

Current - Output High	8 mA
Current - Output Low	8 mA
Current - Quiescent (Max)	2 µA
Grade	Automotive
Input Logic Level - High (Max)	3.85 V
Input Logic Level - High (Min)	1.5 V
Input Logic Level - Low (Max)	1.65 V
Input Logic Level - Low (Min)	0.5 V
Logic Type	NAND Gate
Max CL	50 pF
Max Propagation Delay	8 ns
Mounting Type	Surface Mount
Number of Circuits	1
Number of Inputs	8
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package Length	0.173 in
Package Name	14-TSSOP
Package Width	4.4 mm
Qualification	AEC-Q100
Voltage - Supply (Maximum)	5.5 V
Voltage - Supply (Minimum)	2 V

74AHC30PW-Q100 Series

8-input NAND gate

Part	Input Logic Level - Low (Max)	Input Logic Level - Low (Min)	Current - Output Low	Current - Output High	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Input Logic Level - High (Max)	Input Logic Level - High (Min)	Max Propagation Delay	Max CL	Package Width	Package Name	Package Length	Qualification	Number of Inputs	Grade	Operating Temperature (Max)	Operating Temperature (Min)	Current - Quiescent (Max)	Logic Type	Mounting Type	Number of Circuits
Nexperia USA Inc. 74AHC30PW-Q100J	1.65 V	0.5 V	8 mA	8 mA	5.5 V	2 V	3.85 V	1.5 V	8 ns	50 pF	4.4 mm	14-TSSOP	0.173 in	AEC-Q100	8	Automotive	125 °C	-40 °C	2 µA	NAND Gate	Surface Mount	1

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

74AHC30PW-Q100 Nexperia Product Reliability

Pin FMEA for AHC/AHCT family

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body

Footprint for wave soldering

TSSOP14; Reel pack for SMD, 13"; Q1/T1 product orientation

Nexperia package poster

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body