
BSN20BKR
ActiveNexperia USA Inc.
POWER MOSFET, TRENCH, N CHANNEL, 60 V, 265 MA, 2.1 OHM, SOT-23, SURFACE MOUNT

BSN20BKR
ActiveNexperia USA Inc.
POWER MOSFET, TRENCH, N CHANNEL, 60 V, 265 MA, 2.1 OHM, SOT-23, SURFACE MOUNT
Description
General part information
BSN20BK Series
N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | BSN20BKR |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 265 mA |
| Drain to Source Voltage (Vdss) | 60 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 0.49 nC |
| Input Capacitance (Ciss) (Max) | 20.2 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | TO-236-3, SOT-23-3, SC-59 |
| Package Name | TO-236AB |
| Power Dissipation (Max) | 310 mW |
| Rds On (Max) | 2.8 Ohm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 1.4 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Questions about package outline drawings
RC Thermal Models
Reflow soldering profile
Using power MOSFETs in parallel
Wave soldering profile
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body
LFPAK MOSFET thermal design guide, Chinese version
Reel pack for SMD, 7"; Q3/T4 product orientation
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body
Power MOSFET frequently asked questions and answers
Nexperia package poster
LFPAK MOSFET thermal design guide - Part 2