Specification	MDT850M01501

Card Type	M.2 (NGFF) Mini Card
Color	Black
Contact Finish	Gold
Contact Finish Thickness	30 µin
Contact Material	Copper Alloy
Features	Board Guide, Solder Retention
Gender	Female
Material - Insulation	LCP, Liquid Crystal Polymer
Mounting Type	Right Angle, Surface Mount
Number of Positions	75
Number of Rows	2
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Pitch	0.02 in
Read Out	Dual
Termination	Solder

MDT850 Series

Part	Pitch	Contact Finish	Color	Features	Contact Material	Mounting Type	Gender	Number of Rows	Termination	Contact Finish Thickness	Number of Positions	Read Out	Card Type	Operating Temperature (Min)	Operating Temperature (Max)	Material - Insulation
Amphenol ICC (FCI) MDT850M01501	0.02 in	Gold	Black	Board Guide Solder Retention	Copper Alloy	Right Angle Surface Mount	Female	2	Solder	30 µin	75	Dual	M.2 (NGFF) Mini Card	-40 °C	85 °C	LCP Liquid Crystal Polymer

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