517-83-447-20-121111

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Preci-Dip

CONN SOCKET PGA 447POS GOLD

517-83-447-20-121111

Active

Preci-Dip

CONN SOCKET PGA 447POS GOLD

Description Specifications Series Pricing CAD Documents

Description

General part information

517-83 Series

447 (20 x 20) Pos PGA Socket Gold Through Hole

Technical Specifications

Parameters and characteristics for this part

Specification	517-83-447-20-121111

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	29.5 Ąin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Contact Resistance	10 mOhm
Current Rating	1 A
Features	Open Frame
Grid Columns	20
Grid Rows	20
Housing Material	PCT, Polycyclohexylenedimethylene Terephthalate, Glass Filled, Polyester
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	447
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.125 in
Type	PGA

517-83 Series

Part	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Pitch - Post	Contact Finish - Post	Contact Material - Post	Type	Contact Finish - Mating	Pitch - Mating	Contact Material - Mating	Mounting Type	Housing Material	Termination	Operating Temperature (Max)	Operating Temperature (Min)	Features	Contact Finish Thickness - Mating	Material Flammability Rating	Contact Resistance	Current Rating	Termination Post Length
Preci-Dip 517-83-539-20-101111	20	539	20	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in
Preci-Dip 517-83-361-18-101111	18	361	18	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in
Preci-Dip 517-83-369-18-091111	18	369	18	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in
Preci-Dip 517-83-403-19-111111	19	403	19	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in
Preci-Dip 517-83-529-21-121111	21	529	21	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in
Preci-Dip 517-83-565-21-111111	21	565	21	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in
Preci-Dip 517-83-447-20-121111	20	447	20	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in
Preci-Dip 517-83-325-18-111111	18	325	18	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in
Preci-Dip 517-83-401-19-101111	19	401	19	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in
Preci-Dip 517-83-365-17-091111	17	365	17	0.1 in	Tin	Brass	PGA	Gold	0.1 in	Beryllium Copper	Through Hole	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	125 °C	-55 °C	Open Frame	29.5 Ąin	UL94 V-0	10 mOhm	1 A	0.125 in

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