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BU15JA2DG-CTR

BU15JA2DG-CTR

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Rohm Semiconductor

LDO VOLTAGE REGULATORS BU15JA2DG-C IS HIGH-PERFORMANCE CMOS LDO REGULATORS WITH OUTPUT CURRENT ABILITY OF UP TO 200MA. THE SSOP5 PACKAGE CAN CONTRIBUTE TO THE DOWNSIZING OF THE SET. THESE DEVICES HAVE EXCELLENT NOISE AND LOAD RESPONSE CHARACTERISTICS DESPITE OF ITS LOW CIR

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BU15JA2DG-CTR

BU15JA2DG-CTR

Active
Rohm Semiconductor

LDO VOLTAGE REGULATORS BU15JA2DG-C IS HIGH-PERFORMANCE CMOS LDO REGULATORS WITH OUTPUT CURRENT ABILITY OF UP TO 200MA. THE SSOP5 PACKAGE CAN CONTRIBUTE TO THE DOWNSIZING OF THE SET. THESE DEVICES HAVE EXCELLENT NOISE AND LOAD RESPONSE CHARACTERISTICS DESPITE OF ITS LOW CIR

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Description

General part information

BUxxJA2DG-C Series

BU15JA2DG-C is high-performance CMOS LDO regulators with output current ability of up to 200mA. The SSOP5 package can contribute to the downsizing of the set. These devices have excellent noise and load response characteristics despite of its low circuit current consumption of 33µA. They are most appropriate for various applications such as power supplies for radar modules and camera modules.

Technical Specifications

Parameters and characteristics for this part

SpecificationBU15JA2DG-CTR
Control FeaturesEnable
Current - Output100 mA
Current - Quiescent (Iq)80 µA
GradeAutomotive
Mounting TypeSurface Mount
Number of Regulators1
Operating Temperature (Max)125 °C
Operating Temperature (Min)-40 °C
Output ConfigurationPositive
Output TypeFixed
Package Name5-SSOP
Protection FeaturesOver Current, Over Temperature
PSRR68 dB
QualificationAEC-Q100
Voltage - Input (Max)6 V
Voltage - Output (Min/Fixed)1.5 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
Impedance Characteristics of Bypass Capacitor
SSOP5 Package Information
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Basics of Linear Regulators
How to Use the Thermal Resistance and Thermal Characteristics Parameters
BUxxJA2DG-C, BUxxJA2VG-C Series Dropout Voltage
Basics of Thermal Resistance and Heat Dissipation
Reverse Voltage Protection
SSOP5 Thermal Resistance Data (BUxxJA2DG-C, BUxxJA2VG-C Series)
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Precautions When Measuring the Rear of the Package with a Thermocouple
Problem Situations: Power Supply Does Not Start
Factory Information
Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
Table of resistance for output voltage setting on linear regulator Ics
Design Guide and Example of Stencil for Exposed Pad
Power Supply Sequence Circuit with General Purpose Power Supply IC
EMC Measures for LDOs
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
PCB Layout Thermal Design Guide
How to Select Reverse Current Protection Diodes for LDO Regulators
BUxxJA2DG-C Series Spice Modeling Report
Calculating Junction Temperature from Inrush Current
Thermal Resistance
Solder Joint Rate and Thermal Resistance of Exposed Pad
Six Steps for Successful Thermal Design of LDO Regulator ICs
Two-Resistor Model : BUxxJA2DG-C Series
How to Use the Two-Resistor Model
What Is Thermal Design
Usage of SPICE Macromodel (for LDO)
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Power Source ON/OFF Characteristics for Linear Regulator
Simple Test Method for Estimating the Stability of Linear Regulators
Judgment Criteria of Thermal Evaluation
Connecting LDOs in Parallel
Thermal Calculation for Linear Regulator
Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
Five Steps for Successful Thermal Design of IC