Specification	XA7Z010-1CLG225Q

Architecture	FPGA, MCU
Connectivity	USART, SD, USB OTG, CANbus, MMC, EBI, UART, Ethernet, SPI, I2C, SDIO, EMI
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Grade	Automotive
Number of I/O	86
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package / Case	225-LFBGA, CSPBGA
Package Length	13 mm
Package Name	225-CSPBGA
Package Width	13 mm
Peripherals	DMA
Primary Attributes	28K Logic Cells, Artix™-7 FPGA, Artix™-7 FPGA, 28K Logic Cells
Qualification	AEC-Q100
RAM Size	256 KB
Speed	667 MHz

XA7Z010 Series

Part	Number of I/O	Connectivity	Package / Case	Peripherals	Grade	Qualification	Operating Temperature (Max)	Operating Temperature (Min)	Package Length	Package Name	Package Width	Speed	Architecture	Core Processor	Primary Attributes	RAM Size
AMD / Xilinx XA7Z010-1CLG225Q	86	CANbus EBI EMI Ethernet I2C MMC SD SDIO SPI UART USART USB OTG	225-LFBGA CSPBGA	DMA	Automotive	AEC-Q100	125 °C	-40 °C	13 mm	225-CSPBGA	13 mm	667 MHz	FPGA MCU	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	28K Logic Cells Artix™-7 FPGA Artix™-7 FPGA 28K Logic Cells	256 KB
AMD / Xilinx XA7Z010-1CLG400I	130	CANbus EBI EMI Ethernet I2C MMC SD SDIO SPI UART USART USB OTG	400-LFBGA CSPBGA	DMA	Automotive	AEC-Q100	100 °C	-40 °C	17 mm	400-CSPBGA	17 mm	667 MHz	FPGA MCU	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	28K Logic Cells Artix™-7 FPGA Artix™-7 FPGA 28K Logic Cells	256 KB

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