Specification	S9S08SG16E1MTG

A/D Channels	8 count
A/D Resolution (bits)	10 bit
Connectivity	I2C, SPI, LINbus, SCI
Core Processor	S08
Core Size (Bit Width)	8 Bit
Mounting Type	Surface Mount
Number of I/O	12
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package Length	0.173 in
Package Name	16-TSSOP
Package Width	4.4 mm
Peripherals	WDT, PWM, POR, LVD
Program Memory Depth	16 K
Program Memory Size	16 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	1 K
RAM Size Width	8 bit
Speed	40 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

S08SG Series

Part	Number of I/O	RAM Size Depth	RAM Size Width	Program Memory Depth	Program Memory Width	Program Memory Size	A/D Channels	A/D Resolution (bits)	Operating Temperature (Max)	Operating Temperature (Min)	Core Processor	Program Memory Type	Package Name	Oscillator Type	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Mounting Type	Core Size (Bit Width)	Connectivity	Speed	Package Length	Package Width	Peripherals
NXP USA Inc. S9S08SG8E2CTJR	16	512	8 bit	8 K	8 bit	8 KB	12 count	10 bit	85 °C	-40 °C	S08	FLASH	20-TSSOP	Internal	2.7 V	5.5 V	Surface Mount	8 Bit	I2C LINbus SCI SPI	40 MHz	0.173 in	4.4 mm	LVD POR PWM WDT
NXP USA Inc. S9S08SG32E1MTG	12	1 K	8 bit	32 K	8 bit	32 KB	8 count	10 bit	125 °C	-40 °C	S08	FLASH	16-TSSOP	Internal	2.7 V	5.5 V	Surface Mount	8 Bit	I2C LINbus SCI SPI	40 MHz	0.173 in	4.4 mm	LVD POR PWM WDT
NXP USA Inc. S9S08SG16E1MTG	12	1 K	8 bit	16 K	8 bit	16 KB	8 count	10 bit	125 °C	-40 °C	S08	FLASH	16-TSSOP	Internal	2.7 V	5.5 V	Surface Mount	8 Bit	I2C LINbus SCI SPI	40 MHz	0.173 in	4.4 mm	LVD POR PWM WDT

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