
RSX301L-30TE25
NRNDRohm Semiconductor
HIGH EFFICIENCY , HIGH RELIABILITY TYPE SCHOTTKY BARRIER DIODE

RSX301L-30TE25
NRNDRohm Semiconductor
HIGH EFFICIENCY , HIGH RELIABILITY TYPE SCHOTTKY BARRIER DIODE
Description
General part information
RSX301 Series
RSX301LAM30TF is a schottky barrier diode with low VFand Low IR, suitable for general rectification. It is a highly reliable product for automotive.
Technical Specifications
Parameters and characteristics for this part
| Specification | RSX301L-30TE25 |
|---|---|
| Current - Average Rectified (Io) | 3 A |
| Current - Reverse Leakage | 200 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | SMA, DO-214AC |
| Package Name | PMDS |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 30 V |
| Voltage - Forward (Vf) (Max) | 420 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
How to Use LTspice® Models
Notes for Calculating Power Consumption:Static Operation
Condition of Soldering / Land Pattern Reference
List of Diode Package Thermal Resistance
PCB Layout Thermal Design Guide
About Flammability of Materials
Moisture Sensitivity Level - Diodes
How to Select Rectifier Diodes
Constitution Materials List
Part Explanation
Diode Selection Method for Asynchronous Converter
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
What Is Thermal Design
Inner Structure
Notes for Temperature Measurement Using Thermocouples
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Measurement Method and Usage of Thermal Resistance RthJC
Package Dimensions
Two-Resistor Model for Thermal Simulation
Taping Information
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Absolute Maximum Rating and Electrical Characteristics of Diodes
Report of SVHC under REACH Regulation
About Export Regulations
Impedance Characteristics of Bypass Capacitor
Importance of Probe Calibration When Measuring Power: Deskew
How to Create Symbols for PSpice Models
Anti-Whisker formation - Diodes
What is a Thermal Model? (Diode)
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Compliance of the RoHS directive
ESD Data
Judgment Criteria of Thermal Evaluation
Reliability Test Result
How to Select Reverse Current Protection Diodes for LDO Regulators
Precautions When Measuring the Rear of the Package with a Thermocouple
Power Loss and Thermal Design of Diodes
Method for Monitoring Switching Waveform
RSX301L-30 Data Sheet
Diode Types and Applications
Basics of Thermal Resistance and Heat Dissipation
Explanation for Marking
How to Use LTspice® Models: Tips for Improving Convergence
Datasheet