
BUK9K12-60EX
ActiveNexperia USA Inc.
TRANS MOSFET N-CH 60V 35A 8-PIN LFPAK-D T/R AUTOMOTIVE AEC-Q101

BUK9K12-60EX
ActiveNexperia USA Inc.
TRANS MOSFET N-CH 60V 35A 8-PIN LFPAK-D T/R AUTOMOTIVE AEC-Q101
Description
General part information
BUK9K12 Series
AEC-Q101 automotive grade products rated at 175 °C across the range
Industry benchmark low on-resistance and current handling performance
High performance switching capability for high frequency applications
Technical Specifications
Parameters and characteristics for this part
| Specification | BUK9K12-60EX |
|---|---|
| Channel Count | 2 |
| Configuration | N-Channel |
| Configuration - Features | Dual |
| Current - Continuous Drain (Id) | 35 A |
| Drain to Source Voltage (Vdss) | 60 V |
| FET Feature | Logic Level Gate |
| Gate Charge (Max) | 24.5 nC |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 8-LFPAK56, SOT-1205 |
| Package Name | LFPAK56D |
| Power - Max | 68 VA |
| Qualification | AEC-Q100 |
| Rds On (Max) | 10.7 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs(th) (Max) | 2.1 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
plastic, single ended surface mounted package (LFPAK56D); 8 leads; 1.27 mm pitch; 4.7 mm x 5.3 mm x 1.05 mm body
LFPAK MOSFET thermal design guide, Chinese version
Nexperia package poster
LFPAK MOSFET thermal design guide
Using power MOSFETs in parallel
LFPAK MOSFET thermal design guide - Part 2
LFPAK56D; Reel pack for SMD, 7''; Q1/T1 product orientation
RC Thermal Models
BUK9K12-60E Thermal design model
plastic, single ended surface mounted package (LFPAK56D); 8 leads
Wave soldering profile
Reflow soldering profile
LFPAK56D the ultimate dual MOSFET
Power MOSFET frequently asked questions and answers