Specification	XCV812E-8BG560C

Mounting Type	Surface Mount
Number of Gates	254016
Number of I/O	404
Number of LABs/CLBs	4704
Number of Logic Elements/Cells	21168
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	0 °C
Package / Case	560-LBGA Exposed Pad, Metal
Package Length	42.5 mm
Package Name	560-MBGA
Package Width	42.5 mm
Total RAM Bits	1146880 bits
Voltage - Supply (Maximum)	1.89 V
Voltage - Supply (Minimum)	1.71 V

XCV812E Series

Part	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Total RAM Bits	Mounting Type	Package / Case	Number of Gates	Number of I/O	Number of Logic Elements/Cells	Number of LABs/CLBs	Package Width	Package Name	Package Length	Operating Temperature (Max)
AMD / Xilinx XCV812E-8BG560C	1.89 V	1.71 V	1146880 bits	Surface Mount	560-LBGA Exposed Pad Metal	254016	404	21168	4704	42.5 mm	560-MBGA	42.5 mm	85 °C
AMD / Xilinx XCV812E-7BG560C	1.89 V	1.71 V	1146880 bits	Surface Mount	560-LBGA Exposed Pad Metal	254016	404	21168	4704	42.5 mm	560-MBGA	42.5 mm	85 °C
AMD / Xilinx XCV812E-6BG560C	1.89 V	1.71 V	1146880 bits	Surface Mount	560-LBGA Exposed Pad Metal	254016	404	21168	4704	42.5 mm	560-MBGA	42.5 mm	85 °C

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